IR3100 Infrared BGA Rework Station

Maximum/Minimum PCB Size Maximum：305mm x 305mm (12” x 12”); Minimum: N/A arms close down completely.
Maximum/Minimum Component Size Maximum：65mm (2.5”) x 65mm (2.5”); Minimum: 1mm Sq.
Dimensions：737mm (29") H x 686mm (27") W x 737mm (29") D
Weight (Without Computer)：45kg (100lbs)

BASIC INFO

IR3100 Infrared BGA Rework Station

The IR 3100 can easily install and remove BGA, QFN, μBGA/CSP, Flip Chip and other SMD's. Featuring a 500W infrared (IR) top heater and a 1000W IR bottom preheater, the IR 3100 does not require nozzles. A specially-developed IR pyrometer provides non-contact, real-time, closed-loop temperature control throughout the reflow process. A Sodr-Cam Reflow Camera comes standard, allowing you to watch the entire reflow process in real time. The IR 3100's newly designed Windows-based software makes profiling incredibly simple for even the most advanced applications, providing intuitive set-up, multi-stage profiling, on-the-fly profile adjustment, flux-dipping, unlimited profile storage and much more.

Features

Non-Contact IR Pyrometer

Ultra-High Precision Placement Capability

High Sensitivity Vacuum Pick

Sodr-Cam Reflow Camera

Height Adjustable Bottom-Side Preheater

High-Definition Optical Alignment System

Quad-Field Imaging for Large/Fine Pitch BGA's

Integrated Board Support Wand

Power Distribution Graph

Sensor Offset

Made in the USA