VISCOM iX7059 Module 3D AXI SMT X-ray Inspection Machine

System housing: 1493 mm x 1654 mm x 2207 mm (W x H x D)
High voltage: 130 kV (up to 180 kV optional)
Resolution: 9.5 - 25 μm/pixel
Inspection object weight: Up to 15 kg

BASIC INFO

VISCOM iX7059 Module 3D AXI SMT X-ray Inspection Machine

iX7059 Module Inspection – High process efficiency through 3D X-ray and integrated CT

For manufacturers of power semiconductors, such as IGBT modules and SiC chips, compliance with safety and performance requirements is essential. The quality of each individual solder connection of the components ultimately determines whether overheating and thus failure will occur. The new iX7059 Module Inspection offers seamless and reliable quality assurance for this purpose. The fully automatic 3D X-ray system with integrated computed tomography is distinguished by easy-to-classify, accurate layer inspection images and a large inspection scope.
The X-ray system offers flawless handling of frame-based power modules or components on workpiece carriers. The iX7059 Module Inspection is compact and can be easily integrated into a line. There it fulfills - intelligently networked - all smart factory requirements.

ADVANTAGES AT A GLANCE

100% quality assurance

Future-proof, rapid 3D inline X-ray

Best defect coverage for zero defect strategy

Inspection of solid assemblies with 180kV

Intuitive programming

Inspection Scope

Solder inspection of chip layers