sales@efsmt.com

Efficient Technology Co.,Ltd

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  •  TRI TR7600F2D Plus SMT X-ray Inspection Machine
TRI TR7600F2D Plus SMT X-ray Inspection Machine

TRI TR7600F2D Plus SMT X-ray Inspection Machine

  • X-ray Source: 60 -130 kV
  • Imaging Resolution:5 μm - 30 μm
  • Max PCB Size: 900 x 520 mm
  • Max PCB Weight:12 kg
BASIC INFO

TRI TR7600F2D Plus SMT X-ray Inspection Machine

The 2.5D Inline AXI TR7600F2D Plus is built on a new mechanical platform for faster cycle time, 10% performance improvement compared to the previous model. High Resolution of 5 µm, the TR7600F2D Plus delivers full coverage inspection, ideally for inspection in the consumer electronics industry, such as mobile electronics manufacturing.
The TR7600F2D Plus can reliably detect defects in BGAs, Capacitors, Chips, WLCSP, DIMM Connectors, Flip-Chips, Ground Pads, Gullwing, Heat sinks, J-Leads, LED Chips, LGAs, Paladin Connector, Resistor, RNET, SiP, SMT Connectors, SOIC, SOT, Thermal Pad, QFNs, QFP and THTs.

Features

Next Generation Mechanical Design for Faster Cycle Time
Flexible Multi-Resolution, Multi-Power in one Configuration
New motion controller, for real-time measurements and ease of maintenance
Improved 2D Camera for easier adjustments and less calibration
Large Board Inspection, up to 900 mm x 520 mm
Smart Factory Ready with MES Connectivity

Specification

Camera Flat Panel Detector
X-ray Source 60 -130 kV
Imaging Resolution 5 μm - 30 μm
Inspection Method 2D, 2.5D, Planar CT (optional)
Motion Table & Control
X-Axis Control High-precision ballscrew + AC-servo controller
Y-Axis Control High-precision ballscrew + AC-servo controller
Z-Axis Control High-precision ballscrew + AC-servo controller
X-Y Axis Resolution N/A
Board Handling
Max PCB Size 900 x 520 mm
PCB Thickness 0.5 - 7 mm
Max PCB Weight 12 kg
Top Clearance @ 15/20/25/30 μm: 50 mm
@ 10 μm: 30 mm
@ 5 μm: 10 mm
Bottom Clearance 50 mm
Edge Clearance 3 mm or 5 mm
Conveyor Height 880 - 920 mm
* SMEMA Compatible
Inspection Functions
Capabilities BGAs
Capacitors
Chips
WLCSP
DIMM Connectors
Flip-Chips
Ground Pads
Gullwing
Heat sinks
J-Leads
LED Chips
LGAs
Paladin Connector
Resistor
RNET
SiP
SMT Connectors
SOIC
SOT
Thermal Pad
QFNs
QFP
THTs
Defects Missing
Misalignment
Tombstone
Billboard
Tantalum Polarity
Rotation
Insufficient/Excess Solder
Bridging
Open
Solder Ball
Void
Dimensions
WxDxH 1537 x 2160 x 1800 mm
Note: not including signal tower, height: 519.5 mm
Weight 3150 kg
Power Requirement 200  240 VAC, single phase, 50/60 Hz, 4 kVA

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Company: Efficient Technology Co.,Ltd

Contact: Jacky

Tel: +8613714564591

Phone: +8613714564591

E-mail: sales@efsmt.com

Address: No. 4, Yangyong Industrial Zone, Shapu Community, Songgang Street, Baoan District, Shenzhen

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