TF2800 BGA and SMD Rework System

Placement Accuracy ：28μm (.0011") accuracy
Max PCB Size ：Maximum: 610mm x 610mm (24" x 24"); Minimum: N/A arms close down completely
Max/Min Component Size： Maximum: 65mm (2.5") x 65mm (2.5"); Minimum: 1mm Sq.
Dimensions ：737mm (29") H x 1118mm (44") W x 965mm (38") D

BASIC INFO

TF2800 BGA and SMD Rework System

Conventional resistance coil heating technology has been successfully used in convective rework stations for decades to install and remove a variety of BGA, QFN, CSP, CGA, PoP, Flip Chip, 0201 and other bottom terminated components. However, today’s extremely high thermal mass boards, ultra-fine pitch components and challenging production rework environments demand greater process control, thermal performance and faster throughput than ever before.

Enter PACE’s TF 2800 BGA/SMD Rework System. With its groundbreaking, patented Inductive-Convection Heating Technology, the TF 2800’s top-side heater reaches the target temperature in just seconds for safe, rapid solder joint reflow in virtually any component installation or removal application.

Features

Ultra-Precise 28µm Placement Accuracy

Revolutionary Inductive-Convection Heater

Active Cooling Through Nozzle Provides Rapid Solder Cooldown

4 Thermocouple Inputs

Adjustable Height Bottom-Side IR Preheater

Board Support Beam

Precision 24" x 24" PCB Holder

Auxiliary Cooling Fan

Motorized, High-Def (1080p) Optical Alignment System with Quad-Field Imaging

Single-Axis Operation

Windows 10 Micro PC with 24" LCB Monitor