Nordson AXI XS Series AXI SMT X-ray Inspection Machine

Overview

The XS-platform series is a small-footprint high-resolution automated X-ray inspection system concept designed for sophisticated high-speed inspection of semiconductor samples, wire bonds and PCB-assembly boards for single/multipanels or samples in trays. The inspectable applications range from component level inspection to mid-sized SMT boards.

Four In One - Advanced Technology

X-ray System Features

High speed AXI system with minimum footprint for inline setups

Microfocus / Submicron X-ray tube (sealed tube / maintenance free)

Resolution down to <1µm

Multiple programmable motion system with servo drives

Digital CMOS flatpanel detector

Automatic grey-level and geometrical calibration

Full product traceability via customized MES-Interface

Highlights

Same-side load/unload configuration

Barcode scanner for serial number and product type selection

Auto BCR scanning station (x-y gantry)

Low dose radiation filter

Available Configurations

Depending on the type of product & inspection task

SMT setup for component and solder-joint inspection on PCB, hybrid or chip level assembly processes

Semi-Backend setup for semiconductor applications, wire bond

Test (pre & post), light & complex PCB’s and flex circuits

 XS-2 Transmission (2D) + SFT™

XS-2.5 Transmission (2D) + SFT™ + Off-Axis (2.5D)

XS-3 Transmission (2D) + SFT™ + Off-Axis (2.5D) + 3D SART

Applications

Inspection Technologies

The modular AXI system concept provides the unique capability to use several inspection technologies in one system. Depending on the specific application request the optimum inspection technique can be selected and/or combined.

 

2D Transmission

Transmission is two-dimensional image capturing with a fixed detector position

SFT Slice Filter Technique

High-speed technique using first side image to filter out from double-side image

2.5D-Oblique View

AXI on programmable angle-shots up to 40 dgr (used for high performance BGA and PTH inspection)

3D-SART

3D-Tomsynthesis to generate multiple horizontal slices used for high-dense double-sided and multi-chip-modules (MCM,LGA,…)

Specifications at a Glance

System
Footprint	1760 mm (H) x 1300 mm (W) x 1600 (D)
System Weight	2.320 kg
Power Consumption	Max. 6kW
Line Voltage	208 / 400  VAC, 50/60 Hz 3 phase, 24/16A
Operation Temperature	15° - 28° C optimal 20° - 25° C
Air	5-7 Bar, < 21/min, filtered (30μ), dry, oil free
X-ray Inspection Setup
Off-Axis capability
Angle shot capability	up to 30 deg
FoV range
Transmission FoV	1.9 mm to 25 mm
Standard setup
Max. sample size (W x L)	200 mm x 250 mm - High Res. Setup
	150 mmx 250 mm - Ultra High Res. Setup
Min.  sample size (W x L)	> 25 mm x 60 mm
Max. inspection area (Transmission)	Same as max. sample size (please see above)
Options
Automated Barcodereader station
Substrate handling setup with Magazine loader/ un-loader/laser maker
Top-clamp warpage compensation
Multiple HEPA filter configurations