MPM Edison Solder paste printer

The Edison printer is the industries’ most accurate printer (certified by third party) with +/- 15μ @ 6σ wet print repeatability. Total throughput is lightning fast due in part to the highly-efficient, parallel processing of the stencil shuttle system, stencil wiping, paste dispensing and vision alignment system. The MPM Edison™ stencil printer is ideally suited for the growing Automotive, Semiconductor and Smart Device manufacturing markets. 

designed to meet the demandfor increasing throughput, yieldand performance requirementsfrom the automotive, smartdevice and semiconductormarkets. Edison is optimized forultra-fine pitch (0201M)printing with a transferefficiency up to 75% for smallapertures.

Edison's ultras-fast, highefficiency wiping systemfeatures a super-size 65m paperroll with patented constanttension control, makes 10,000prints possible before a rollchange is needed, reducingdowntime and operator
interface.The wiping zone isisolated from the printing zoneto avoid cross contamination.

Edison's advanced print headfeatures a single high precisionload cell with closed-looppressure control and motordrive system enable precise andconsistent squeegee forcecontrol across print stroke inboth directions, which helpsimprove yields especially forchallenging thin substrateprinting in the semiconductorindustry.

Dispense for standardcartridges or choose the newpatent-pending jar dispenser.
Paste is released in precise,
measured amounts across the
stencil in a clean, uniformbead. Deposition volumes,frequency and placement areuser programmable.

Ouick release squeegee bladesmake changing blades quickand easy with no toolsrequired. lt takes less than 30seconds to change the blade.

Edison features a high-speedvision alignment system withan ultra-thin camera.Theoverall gantry thickness is only39 mm featuring an on the fly'POE'(Power Over Ethernet)camera.A single CCD split feldprovides precision
simultaneous up-down imageacquisition with a feld of view9.0 x 6.0 mm.

The EdgeLoc system uses a sidesnugging technique thatremoves the need for top
clamps which interfere with thePCB to stencil contact.The
result is optimal gasketing andmore volumetrically consistentedge-to-edge prints. Choose therobust EdgeLoc ll with side onlyclamping or EdgeLoc+ which
can change between edge andtop clamping.

Board Staging is a new Edisonfeature that provides the abilityto have three boards in themachine simultaneously. lt pre.loads the next board on theinput conveyor during the printprocess resulting in reducedtransfer times and improved
cycle time.

MPM's Adjustable Stencil Shelfprovides the flexibility tohandle all stencil sizes with asimple adjustment of the shelf.The robust design providesbetter stability on all stencil
size5.

The next generation MPMEdison stencil printer is
designed to meet the demandfor increasing throughput, yieldand performance requirementsfrom the automotive, smartdevice and semiconductormarkets. Edison is optimized forultra-fine pitch (0201M)printing with a transferefficiency up to 75% for smallapertures.

Featured Technology and Benefits

Faster Throughput for a Better Process

Edison’s parallel processing system is extremely fast resulting in a very short cycle time. This helps increase throughput by shortening total time per PCB printed. This leaves more time for key overhead functions that have the biggest impact on print quality:

Print at slower speeds to decrease variability

Utilize slow stencil separation for optimal print definition

Double stroke after wipe

More frequent wiping resulting in higher yields

Time leftover to optimize settings for maximum possible yields

Incomparable Wet Print Accuracy

Best-in-class printing with a 25% improvement in wet print accuracy over current printers: Built-in +/- 8 micron alignment, and +/- 15 micron wet print repeatability (≥2 Cpk @ 6σ) proven through 3rd party Print Capability Analysis (PCA) testing.

Back To Back (BTB) Configurable

BTB is a flexible dual lane solution without adding line length; identical single-lane printers are easily re-deployed to other lines when needed. Use in BTB configuration, or singly as a stand-alone.

Intueri Graphical User Interface

MPM Intueri is a simple, intuitive operator interface with a flexible, wide array of configuration variables. It is combined with OpenApps for maximum capability and connectivity and provides a portal to Industry 4.0 concepts.

Advanced Print Head

Single axis closed-loop pressure control for dual squeegee eliminates front-to-back variation; a single high precision load cell provides squeegee force, and a unique algorithm calibrates out non-linearity, maintaining the set pressure across the entire board surface.

Ability to have three boards in the machine simultaneously, reduced distance on input conveyor by pre-loading the board during the print process results in reduced transfer times and improved cycle time.

Intueri and Industry 4.0 Integration

MPM Intueri is a simple, intuitive operator interface with a flexible, wide array of configuration variables. It is combined with Open Apps for maximum capability and connectivity and provides a portal to Industry 4.0 concepts.

OpenApps™ is an open application interface with a development kit that allows customers to develop custom interfaces in support of Industry 4.0 initiatives. Using OpenApps we can provide support for factory automation standards such as Hermes and Pulse and communication with Manufacturing Execution Systems (MES). MPM printers support industry standards like CamX, SECS/GEM and SMEMA.

The Edison SECS/GEM package provides a ready-made interface that enables MES integration for product verification, traceability, and other MES functionalities. SECS/GEM is a semiconductor industry communication standard that provides a common interface for MES connectivity.

Paste Height Monitor

The Paste Height Monitor is designed to prevent defects caused y inadequate volumes of paste on the stencil. It combines advanced software and sensor technology to accurately monitor the paste bead for volume consistency. Upper and lower limit roll-height monitoring eliminates insufficient or excess paste volumes. It is a non-contact solution that can automatically add more paste to the stencil as it is needed.

PrinTrack

The PrinTrack feature adds traceability, data harvesting, and reporting to your printing process. With PrinTrack, you always have an easy access to a comprehensive history, detailing:

How your product was printed

When it was printed 

The process parameters used to print the board

All pertinent information that can be used to track products or troubleshoot the process if needed.

SPI Print Optimizer

The SPI print optimizer communicates with the external Solder Paste Inspection (SPI) system to continuously monitor and auto-correct X, Y, and Theta registration ‘on the fly’ to stay on target and prevent print defects.

Ultra-fast, High Efficiency Wiping System

A super-size 65m paper roll allows 10,000 prints per change. Patented paper tension control provides more effective wiping and a separate wiping and printing zone prevents cross contamination.