MPM Edison II ACT Solder paste printer

Overview

The MPM Edison II ACT (Automated Changeover Technology) was developed based on the proven MPM Edison platform, the industry's most accurate printer with advanced technology. With a built-in ±8 micron machine alignment, and ±15 micron wet print accuracy (≥2 Cpk @ 6 sigma, Edison's wet print accuracy.  The Edison II ACT has a proven process capability greater than 2Cpk for 0201 metric components, an ideal solution to meet the increasing miniaturization and board component density challenges in Semiconductor, Automotive, Smart Devices and etc.

Production line changeover is one of the most labor intensive, time consuming, and error prone tasks in the electronics manufacturing.  This innovative MPM patented Automated Changeover Technology (ACT) provides a simple, cost-effective and progressive solution toward the end goal for factory automation. 

Automated Changeover Scope and capabilities

3 Paste cartridge

Dedicated tooling plate

2 Squeegees

Stencil

Integral scanner for verification

MES enabled

MPM solution differentiators

Adaptive

Easy to use, simple to adopt

Attractive ROI for users

Scalable

Baseline machine ACT upgradeable

Tiered offering – variety of use cases

Customer benefits

Error free and scrap free changeover

Labor and skill dependence reduction

Changeover time reduction

OEE improvements

Featured Technology and Benefits

Faster Throughput for a Better Process

Edison’s parallel processing system is extremely fast resulting in a very short cycle time. This helps increase throughput by shortening total time per PCB printed. This leaves more time for key overhead functions that have the biggest impact on print quality:

Print at slower speeds to decrease variability

Utilize slow stencil separation for optimal print definition

Double stroke after wipe

More frequent wiping resulting in higher yields

Time leftover to optimize settings for maximum possible yields

Incomparable Wet Print Accuracy

Best-in-class printing with a 25% improvement in wet print accuracy over current printers: Built-in +/- 8 micron alignment, and +/- 15 micron wet print repeatability (≥2 Cpk @ 6σ) proven through 3rd party Print Capability Analysis (PCA) testing.

Automated Stencil, Squeegee, and Tooling Changeover

Edison II ACT completely automates the changeover of the stencil, tooling and squeegees. It provides a fast and consistent changeover without opening the hood of machine to access inside.  The operator removes the current run stencil from the printer and then loads a tray that holds the next run squeegees and tooling.  The Edison II ACT then automatically removes the current run squeegees and support tooling and loads them onto the tray.  The printer then automatically installs the next run items, and the operators removed the tray.

Automated Paste Changeover

The automated paste changeover system features a carousel that holds three 12 oz. or 6 oz. cartridges.  The printer unloads the used cartridge into the carousel which then spins into position for a new cartridge to be loaded.  A built-in barcode scanner verifies that the correct cartridge is being loaded.  A side door on the printer allows loading and removal of cartridges on the fly without stopping production. Indicator lights above the door lets the operator know if they correct paste for the selected process is loaded or if a cartridge is missing or needs attention. 

Back To Back (BTB) Configurable

BTB is a flexible dual lane solution without adding line length; identical single-lane printers are easily re-deployed to other lines when needed. Use in BTB configuration, or singly as a stand-alone.

Advanced Print Head

Single axis closed-loop pressure control for dual squeegee eliminates front-to-back variation; a single high precision load cell provides squeegee force, and a unique algorithm calibrates out non-linearity, maintaining the set pressure across the entire board surface.

Board Staging

Ability to have three boards in the machine simultaneously, reduced distance on input conveyor by pre-loading the board during the print process results in reduced transfer times and improved cycle time.

EdgeLoc Board Clamping System

The EdgeLoc system uses a side snugging technique that removes the need for top clamps which interfere with the PCB to stencil contact. The result is optimal gasketing and more volumetrically consistent edge-to-edge prints. With EdgeLoc II, robust flippers engage to secure the board across the top edge ensuring board flatness then move out of the way once the board is firmly gripped from the side. EdgeLoc+ board clamping can change between edge and top clamping simply through software.

High Flow Venturi with Closed-loop

NEW The High Flow Venturi System with closed-loop control represents a major advancement, blending digital programmability with exceptional flexibility and simplicity in setup. Its precise programmability, adaptability to different substrate thicknesses, and focus on maintaining quality consistency make it an invaluable asset for boosting productivity and yield.

High Speed Vision Alignment with Ultra-slim Camera

Edison features a high-speed vision alignment system with an ultra-thin camera. The overall gantry thickness is only 39 mm featuring an ‘on the fly’ ‘POE’ (Power Over Ethernet) camera. A single CCD split field provides precision simultaneous up-down image acquisition with a field of view 9.0 x 6.0 mm.

Intueri and Industry 4.0 Integration

MPM Intueri is a simple, intuitive operator interface with a flexible, wide array of configuration variables. It is combined with Open Apps for maximum capability and connectivity and provides a portal to Industry 4.0 concepts.

OpenApps™ is an open application interface with a development kit that allows customers to develop custom interfaces in support of Industry 4.0 initiatives. Using OpenApps we can provide support for factory automation standards such as Hermes and Pulse and communication with Manufacturing Execution Systems (MES). MPM printers support industry standards like CamX, SECS/GEM and SMEMA.

The Edison SECS/GEM package provides a ready-made interface that enables MES integration for product verification, traceability, and other MES functionalities. SECS/GEM is a semiconductor industry communication standard that provides a common interface for MES connectivity.

Paste Height Monitor

The Paste Height Monitor is designed to prevent defects caused y inadequate volumes of paste on the stencil. It combines advanced software and sensor technology to accurately monitor the paste bead for volume consistency. Upper and lower limit roll-height monitoring eliminates insufficient or excess paste volumes. It is a non-contact solution that can automatically add more paste to the stencil as it is needed.

PrinTrack

The PrinTrack feature adds traceability, data harvesting, and reporting to your printing process. With PrinTrack, you always have an easy access to a comprehensive history, detailing:

How your product was printed

When it was printed 

The process parameters used to print the board

All pertinent information that can be used to track products or troubleshoot the process if needed.

SPI Print Optimizer

The SPI print optimizer communicates with the external Solder Paste Inspection (SPI) system to continuously monitor and auto-correct X, Y, and Theta registration ‘on the fly’ to stay on target and prevent print defects.

Ultra-fast, High Efficiency Wiping System

A super-size 65m paper roll allows 10,000 prints per change. Patented paper tension control provides more effective wiping and a separate wiping and printing zone prevents cross contamination.