Hanwha CP3-C Solder paste printer
Sp3-Chelps customersexperience the printer of thefuture smart era as well as thebest printing quality
Realizes high-precision printing with alignment accuracy of ±8um
Corrects print offset automatically by feeding back defective SPI printing
port for Mixed Production
Features
Best Quality
Printing Technoy
Allows printing in the direction of both X and Y axes and realizes the best printing quality by applying SQG Blade Tilting Technoy.
2D Inspection
Prevents Defective Printing
Possible to per 2DI of a PCB for insufficient soldering, excessive soldering, and solder bridges as well as foreign materials.
SPI Feedback System
Improves Printing Quality
Corrects the printing offset automatically by feeding back to the machine the data inspected by the SPI machine.
Cleaning Technoy
Improves User Convenience and Cleaning Perance
Improves the user convenience of the Cleaner Module and increases cleaning perance by applying the Solvent Dipping technoy.
Specifications
Alignment Repeatability | ±8μm@6σ, Cpk2.0 | |
Wet Print | ±15μm@6σ, Cpk2.0 | |
Cycle Time | 5 sec | |
PCB | Max. Size (mm) | L350 x W250 (Single Lane) |
L350 x W250 (Dual Lane/Option) ** | ||
Min. Size (mm) | L50 x W50 | |
Thickness (mm) | 0.3 ~ 3.9 | |
Max. Weight (kg) | 1.5 | |
Metal Mask | Min. Size (mm) | L550 x W650 |
Max. Size (mm) | L650 x W550, L736 x W736 | |
Frame Thickness (mm) | 30 ~ 40 | |
Matching | Center Standard | |
Utility | Power Supply | 100/110/120/200/220/240V (±5 %) Single Phase |
Max. 4.5 kVA, 50/60 Hz | ||
Air Supply | Pressure 4.5 ~ 7.0 kgf/cm2, Max. 700 Nℓ/min | |
External Dimension | W1,376 * x D1,200 x H1,430 mm | |
(Standard) |