MPM Momentum II BTB Stencil Printer Solder paste printer

Momentum® II BTB features a smaller footprint than the standard Momentum platform. Back-to-Back configuration allows dual lane processing for higher throughput without increasing line length or capital investment. Dual lane provides the flexibility to print multiple products in a single SMT line, such as top and bottom side, same side, or mother/ daughter boards making the BTB the most flexible model in the proven Momentum platform.

Featured Technology and Benefits

More Throughput in Less Space

The Momentum II BTB printer is a space-saving 200 mm shorter than the standard Momentum II printer. Configure for dual-lane processing by positioning two BTB printers back-to-back in a manufacturing line. Dual-lane processing generates the output of two printers in the length of one.

Ultimate Flexibility in the Momentum Platform

Use the MPM printer in-line as a stand-alone or configure back-to-back for dual-lane output.  Print multiple products in a single SMT line, for example, print top and bottom sides, print the same side, or print mother/daughter boards. The Momentum II BTB printer comes in two different throughput configurations for optimum flexibility in line balancing.

Match Printer Strategy to Dual Lane Strategy

The Momentum II BTB printer allows total front-side accessibility and service, with open access to the electrical system, solvent reservoir, and other key components. Because the BTB printer requires no read access or extra buffer space, position each printer to maximize your facility floor space.

Proven Momentum Series Accuracy and Performance

Alignment repeatability of ±11 microns @ 6 sigma, Cpk ≥2 and wet Print accuracy of 17µm@6σ, Cpk ≥ 2, with 6σ capability designed in and independently verified. The MPM Momentum II series printers are fast, precise, and highly reliable, with performance unmatched by any other printer in their class.

Benchmark™ User Interface

Easy to learn and use for the average operator, MPM’s Benchmark software is powerful yet intuitive, and facilitates rapid setup, assists with operational tasks, and makes changeover quick and easy. The software has been upgraded to Windows 10 and new production tools and new Quickstart programming to make it even easier to use.

AccuCheck Print Capability Verification

AccuCheck Print Capability Verification allows the printer to measure its own print capability. Users can verify the machine’s capability at any time or continuously on their own products. AccuCheck measures the actual print deposit position versus the target pad to determine a measured print offset. It is an inexpensive, reliable method of obtaining machine quality and process capability information to ensure repeatable results and optimum printing performance.

Adjustable Stencil Shelf

Provides the flexibility to handle all stencil sizes with a simple adjustment of the shelf. The robust design provides better stability on all stencil sizes.

Automatic Paste Dispensing System

Dispense for standard cartridges or choose the new patent-pending jar dispenser. Paste is released in precise, measured amounts across the stencil in a clean, uniform bead. Deposition volumes, frequency and placement are user programmable.

BridgeVision and StencilVision System

BridgeVision is a patented method of analyzing bridge defects on circuit boards in the post-print inspection process. This innovative system utilizes texture-based image acquisition algorithms and a digital camera system with telecentric lenses to support the accurate identification of paste deposit defects.

StencilVision utilizes texturebased technology to check the underside of a stencil for solder paste contamination. Wiper operation can be driven by the results obtained.

EdgeLoc Board Clamping System

The EdgeLoc system uses a side snugging technique that removes the need for top clamps which interfere with the PCB to stencil contact. The result is optimal gasketing and more volumetrically consistent edge-to-edge prints. With EdgeLoc II, robust flippers engage to secure the board across the top edge ensuring board flatness then move out of the way once the board is firmly gripped from the side. EdgeLoc+ board clamping can change between edge and top clamping simply through software.

EnclosedFlow™ Print Head

The EnclosedFlow print head offers significant process and cost advantages over printing with metal squeegee blades, particularly for fine-feature printing. Solder paste is held within an enclosed chamber, and is directly pressurized during the print stroke to provide uniform and complete aperture filling for the full range of aperture sizes and fill types.

The EnclosedFlow print head delivers superior volume/yield on fine pitch pads. Print fine pitch features such as 01005s and 0.3 mm pitch CSPs with up to 50% greater volume and 25% lower deviation that squeegee blades. The EnclosedFlow print head ensures optimal aperture filling for fine pitch devices and crisp uniform printing with less waste.

High Flow Venturi with Closed-loop

NEW The High Flow Venturi System with closed-loop control represents a major advancement, blending digital programmability with exceptional flexibility and simplicity in setup. Its precise programmability, adaptability to different substrate thicknesses, and focus on maintaining quality consistency make it an invaluable asset for boosting productivity and yield.

OpenApps Architecture

MPM’s OpenApps is an open architecture source code which provides the capability of developing custom interfaces in support of Industry 4.0 initiatives and communication with Manufacturing Execution Systems (MES). ITW EAE is the first SMT company to offer open software architecture.

Paste Height Monitor

The Paste Height Monitor is designed to prevent defects caused y inadequate volumes of paste on the stencil. It combines advanced software and sensor technology to accurately monitor the paste bead for volume consistency. Upper and lower limit roll-height monitoring eliminates insufficient or excess paste volumes. It is a non-contact solution that can automatically add more paste to the stencil as it is needed.

Paste Temperature Monitor

Temperature monitoring ensures proper paste viscosity to avoid bridging and voiding. MPM patent- pending paste temperature monitor allows paste to be measured in the cartridge or on the stencil.

PrinTrack

PrinTrack™ adds traceability, data harvesting and reporting to your printing process. It can seamlessly integrate with other equipment and elements in the manufacturing cycle, such as MES and ERP, and can be expanded factory-wide.

Quick Release Squeegee

New quick release squeegee blades make changing blades quick and easy with no tools required.  It takes less than 30 seconds to change the blade.

RapidClean™ Stencil Cleaner

RapidClean is a high-speed under-stencil cleaning system offered on MPM Momentum series printers. RapidClean is the fastest stencil cleaning solution available.

SPI Print Optimizer

SPI Print Optimizer brings your Solder Paste Inspection (SPI) machine into communication with your MPM printer through a specially-developed common interface. When the SPI machine ‘sees’ X, Y and theta offset problems on a just-printed PCB, it analyzes the data virtually instantly and gives the printer instructions to correct those offsets, automatically, and ‘on the fly’.

MPM Vision System & Inspection

MPM’s patented printe rbased Vision and Inspection system is a cost-effective way to verify print and paste deposit results. It is flexible enough to handle the complete range of today’s most challenging components. This system measures the amount of paste covering the target pad and compares it with the required coverage. 2D inspection is integrated directly into the stencil printer to provide an immediate source of data.