GKG G-Titan Solder paste printer
As the trade is getting more and more involved in Industry 4.0, it is understood that customers are also expecting to transform their operations, yielding higher productivity and competitiveness. Strategically equipped with OPC (Optimum-Paste Control), G-Titan makes your journey towards lights-out manufacturing a seamless one.
Complemented by QPC (Quality-Print Control), G-Titan firmly stands behind the belief that nothing is more important than a good print. These revolutionary changes to the fundamental aspects of the SMT printer will bring about an efficiency that you’ve never experienced before
STANDARD FEATURES & PERFORMANCE
OPTIMUM-PASTE CONTROL (OPC) - Get Ready For Lights - Out Manufacturing
Auto Paste Dispensing
The paste is automatically dispensed across the entire squeegee length, maintaining at 15mm rolling diameter, adopting the common 500 grams’ solder paste jar. Completely eliminates the wastage of solder paste overflowing to the sides of squeegee.
Paste Rolling Diameter Monitoring System
Tracing solder paste rolling diameter in real time and trigger the auto dispensing if it falls below 10mm. Completely eliminate insufficient solder paste on stencil and keep the paste rolling speed within optimum range to achieve best printing result with this smt printer.
OPC Squeegee
Retainers at both sides can be adjusted to the exact length of the PCB, enabling solder paste to be retained within the PCB length to obtain a clean sweep. Possess absolute control over desired printing area, to achieve best printing quality using this smt printer.
QUALITY PRINT CONTROL (QPC) - NOTHING IS MORE IMPORTANT THAN A GOOD PRINT
Stencil Aperture Inspection System
Using panel light installed at the top and CCD camera below to inspect stencil apertures. It automatically detects the clogging of stencil apertures to eliminate poor quality stencil being used, ensure quality printing right from the start.
The Stencil Lock & PCB Clamper
The Stencil Lock sucks the stencil firmly on both sides of the conveyor during printing cycle. To eliminate stencil vibration by having firm contact with PCB. The PCB clamper is a combination of retractable top clamp and motor controlled side clamp, uniquely designed by GKG (patented). With these standard features, all of today’s available and challenging substrates can be securely clamped and print to the highest quality.
OPTIONAL FEATURES
Ready for Industry 4.0
Through machine status, parameters can be uploaded automatically. Designed to support customers’ advancement towards Industry 4.0 intelligence production, G-Titan provides seamless connection with users’ MES system, enhancing product traceability and maintenance needs.
SPI Close-loop Connection
With SPI close-loop system, machine will automatically adjust and correct the print deposits based on the feedback given with regards to poor printing quality. This will facilitate improved print quality and production efficiency, by forming a complete printing feedback system.
Back to Back (BTB)
2 Machines back to back is a perfect match to all dual lane SMT lines. The machines can be operated independently of each other, running different types of product.
Auto Glue Dispensing
Attached on CCD Camera XY axis, the dispenser provides basic function of glue dotting using syringe type dispensing needle after solder paste printing.
Performance | |
Machine Alignment Capability | 2 Cmk @ ± 10 microns 6 sigma |
Process Alignment Capability | 2 Cpk @ ± 18 microns 6 sigma |
Core Cycle Time | < 8.5 secs |
(excluding printing & cleaning time) | |
Product Changeover Time | < 3 mins |
New Product Set-up Time | < 10 mins |
FACILITIES REQUIREMENT | |
Power Supply | AC220V ± 10% 50/60Hz |
Power Consumption | 3kW |
Air Supply | 4 ~ 6Kgf/cm² |
Air Consumption | 5L/min |
Dimension (excluding signal tower) | 1,240 mm (L) x 1,560 mm (W) x 1,490 mm (H) |
Machine Weight | 1,200kg |
Board Handling | |
Max. Size (L x W) | 510 mm x 510 mm |
Min. Size (L x W) | 50 mm x 50 mm |
Thickness | 0.4~6 mm |
PCB Thickness Adjustment | Automatic |
PCB Max. Weight | 5 kg |
PCB Edge Clearance | 3 mm |
PCB Bottom Clearance | 23 mm |
PCB Warpage | Max. 1% diagonally |
Clamping Method | Auto retractable top clamp, motor controlled side clamp |
Support Method | Magnetic support pins, bars, blocks, vacuum suction |
Conveyor Direction | L to R, R to L, R to R, L to L |
(software control) | |
Conveyor Height | 900 ± 40 mm |
Conveyor Speed | 1,500 mm/s |
Conveyor Width Adjustment | Automatic |
OPERATOR INTERFACE | |
Hardware | LCD Monitor, Mouse & Keyboard |
Operating System (OS) | Windows 10 |
Control Method | Industrial PC controlled |
I/O Interface | SMEMA Standard |
OPTICAL SYSTEM | |
Field-of-View (FOV) | 10mm x 8mm |
Fiducial Types | Circle, triangle, square, diamond, cross |
Fiducial Size | 0.5~4.0 mm |
Vision Methodology | Digital CCD camera look up & down |
2D Inspection | Max.100 windows to inspect missing & insufficient (std.) |
PRINTING PARAMETERS | |
Stencil Frame Size (L x W) | Adjustable, 470 mm x 370 mm to 737 mm x 737 mm |
Print Gap (snap-off) | 0~20 mm |
Printing Table Adjustment Range | X: ±10 mm, Y: ±10 mm : ± 2° |
Print Speed | 10~200 mm/s |
Squeegee Pressure | 0.5~10kg (program control) |
Squeegee Type | Std.: OPC Squeegee 300 mm, 450 mm & Metal Squeegee 520mm. Option: Rubber |
Squeegee Angle | Std. 60°, Option 45°, 50°, 55° |
Cleaning System | Auto wet, dry, vacuum (Software select) |