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Efficient Technology Co.,Ltd

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  •  GKG GL-STAR Solder paste printer
GKG GL-STAR Solder paste printer

GKG GL-STAR Solder paste printer

  • Core Cycle Time (excluding printing & cleaning time) :< 8.5 secs
  • PCB Bottom Clearance :23 mm
  • Conveyor Height:900 ± 40 mm
  • Print Speed:10~200 mm/s
BASIC INFO

GKG GL-STAR Solder paste printer

The Fully Automatic SMT Printer GL-Star features machine vision technology for automatic identification, employing a high-precision servo drive dynamic system to ensure fast and accurate alignment.

Computer control enables effortless adjustment of printing height, squeegee pressure, printing stroke, speed, cleaning cycle, and other printing parameters with just a simple click

The GL-Star is equipped with features such as auto stencil positioning, automatic top clamp & motorized side clamp, and stencil lock. These capabilities help ensure superior printing quality with minimal human intervention.

STANDARD FEATURES

Back to Back Ready

2 machines back-to-back are perfect match for dual-lane SMT line. Therefore, the internal structure of the GL-Star is pre-assembled in back-to-back configuration. It can be used as a stand-alone unit, or additional equipment can be seamlessly added in a back-to-back mode in future.

Auto Stencil Positioning

The stencil Y position is adjustable via user interface, and the settings can be saved and reapplied when replacing the stencil. This function significantly reduces human errors and saves time in readjusting stencil position.

Stencil Lock

The stencil lock vacuum suction firmly holds the stencil on both sides of the conveyor during printing cycle, eliminating stencil vibration by having firm contact with the PCB.

PCB Clamper

The PCB clamper is a combination of retractable top clamp and motor controlled side clamp, uniquely designed by GKG (patented). With these standard features, all of today’s available and challenging substrates can be securely clamped and print to the highest quality.

Optional Features

Ready for Industry 4.0

Through machine status, parameters can be uploaded automatically. Designed to support customers’ advancement towards Industry 4.0 intelligence production, GL-Star provides seamless connection with users’ MES system, enhancing product traceability and maintenance needs.

SPI Close-loop Connection

With SPI close-loop system, machine will automatically adjust and correct the print deposits based on the feedback given with regards to poor printing quality. This will facilitate improved print quality and production efficiency, by forming a complete printing feedback system.

STANDARD FEATURES

Back to Back Ready

2 machines back-to-back are perfect match for dual-lane SMT line. Therefore, the internal structure of the GL-Star is pre-assembled in back-to-back configuration. It can be used as a stand-alone unit, or additional equipment can be seamlessly added in a back-to-back mode in future.

Auto Paste Dispensing

The paste is automatically dispensed across the entire squeegee length, maintaining at 15mm rolling diameter, adopting the common 500 grams’ solder paste jar. Completely eliminates the wastage of solder paste overflowing to the sides of squeegee.

Stencil Aperture Inspection System

Using panel light installed at the top and CCD camera below to inspect stencil apertures. It automatically detects the clogging of stencil apertures to eliminate poor quality stencil being used, ensure quality printing right from the start.

Performance
Machine Alignment Capability 2 Cmk @ ± 12.5 microns 6 sigma
Process Alignment Capability 2 Cpk @ ± 20 microns 6 sigma
Core Cycle Time < 8.5 secs
(excluding printing & cleaning time)
Product Changeover Time < 3 mins
New Product Set-up Time < 10 mins
FACILITIES REQUIREMENT
Power Supply  AC220V ± 10% 50/60Hz
Power Consumption 3kW
Air Supply 4 ~ 6Kgf/cm²
Air Consumption 5L/min
Dimension (excluding signal tower) 1,240mm (L) x 1,410mm (W) x 1,500mm (H)
Machine Weight 1,200kg
Board Handling
Max. Size (L x W) 510 mm x 510 mm
Min. Size (L x W) 50 mm x 50 mm
Thickness 0.4~6 mm
PCB Thickness Adjustment Automatic
PCB Max. Weight 5 kg
PCB Edge Clearance 3 mm
PCB Bottom Clearance 23 mm
 PCB Warpage Max. 1% diagonally
 Clamping Method Auto retractable top clamp, motor controlled side clamp
 Support Method Magnetic support pins, bars, blocks, vacuum suction
 Conveyor Direction L to R, R to L, R to R, L to L
(software control)
 Conveyor Height 900 ± 40 mm
 Conveyor Speed 1,500 mm/s
Conveyor Width Adjustment Automatic
OPERATOR INTERFACE
Hardware LCD Monitor, Mouse & Keyboard
Operating System (OS) Windows 10
Control Method Industrial PC controlled
I/O Interface SMEMA Standard
OPTICAL SYSTEM
Field-of-View (FOV) 10mm x 8mm
Fiducial Types Circle, triangle, square, diamond, cross
Fiducial Size 0.5~4.0 mm
Vision Methodology Digital CCD camera look up & down
2D Inspection Max.100 windows to inspect missing & insufficient (std.)
PRINTING PARAMETERS
Stencil Frame Size (L x W) Adjustable, 470 mm x 370 mm to 737 mm x 737 mm
Print Gap (snap-off) 0~20 mm
Printing Table Adjustment Range X: ±10 mm, Y: ±10 mm : Θ ±2°
Print Speed 10~200 mm/s
Squeegee Pressure 0.5~10kg (program control)
Squeegee Type Std.: Metal Squeegee 280 mm, 350 mm & 520mm. Opt.: Rubber
Squeegee Angle Std. 60°, Opt. 45°, 50°, 55°
Cleaning System Auto wet, dry, vacuum (Software select)

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Company: Efficient Technology Co.,Ltd

Contact: Jacky

Tel: +8613714564591

Phone: +8613714564591

E-mail: sales@efsmt.com

Address: No. 4, Yangyong Industrial Zone, Shapu Community, Songgang Street, Baoan District, Shenzhen

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