ESE ES-D2 Solder paste printer

Compact footprint

Back-To-Back (BTB) configurable

23”, 29” stencil available

3 stages conveyor system

PCB Size

50㎜ x 50㎜ - 400㎜ x 300㎜

PCB Thickness

0.3㎜ to 6㎜

Stencil Mark Size

550㎜, 584㎜(23”), 650㎜, 736㎜(29”)

Core Cycle time

6sec / under optimized condition

Alignment Accuracy

±12.5 ㎛ @ 6 sigma

Printing Repeatability

±20 ㎛ @ 6 sigma , Cmk ≥2.0