ESE ES-D1 Solder paste printer

Compact footprint

Back-To-Back (BTB) configurable

Optional shuttle conveyor for BTB

3 stages conveyor system

PCB Size

50㎜ x 50㎜ – 350㎜ x 250㎜
[* Optional 380㎜ x 280㎜]

PCB Thickness

0.3㎜ to 6㎜

Stencil Mask Size

550㎜ , 584㎜ (23”), 650㎜

Core Cycle time

5sec / under optimized condition

Alignment Accuracy

±12.5 ㎛ @ 6 sigma

Printing Repeatability

±25 ㎛ @ 6 sigma , Cmk ≥2.0