sales@efsmt.com

Efficient Technology Co.,Ltd

Hotline

+8613714564591

  •  DESEN DG Solder paste printer
DESEN DG Solder paste printer

DESEN DG Solder paste printer

  • Cycle Time:7s
  • Substrate Thickness:0.4mm -6mm
  • Print Speed:1 -200mm/s
  • Substrate Separation:Speed:0.1-20mm/sec Distance:0mm - 20mm
BASIC INFO

DESEN DG Solder paste printer

Classic Z-axis lifting platform

Integrated molding structure of the entire machine frame

Scraper upper and lower direct connection screw drive

Automatic intelligent cleaning system for steel mesh

Adjustable size of stencil frame

Printing cycle time 7s

Application Scenario

5G

Semiconductor

3C Products

Photovoltaic Products

New Display

Automotive Electronics

Medical Treatment

New Energy

Product Advanced Options

Solder Paste Monitoring System

The sensor will detect the diameter of solder paste remained under the front squeegee to remind the opreator to supply paste.


Automatic Supply Solder Paste
It's controlled by electricity and also capable for supplying the solder paste atfixed times.

Stencil Aperture Inspection
Stencil aperture inspection can be programmed to be carried out automaticallyto detect clogging on stencil opening, eliminate poor printing from the begining.

Automatic Dispensing Unit
Attached on CCD Camera XY axis, the dispenser provides basic function of gluedotting using syringe type dispensing needle after solder paste printing.

UPS
It will keep the power supply to PC for 10 minutes after power off to protect theproduction data.

Temperature&Humidity Control System
There are 3 options for this function:
T&H both are controlled.
Temperature control&Humidity detect.
T&H both detect and display.

Industry 4.0
Customize the different communications modes of customers to realizeintelligent operation management.
Product output and manufacturing data analysis and statistics in real-time.
Intelligent alarm & prompt system and processing solution.
Bar-code recognition.


Product Parameter

Parameters Specification
Model DG
Screen Frame Size 470mm x 370mm~737mm x 737mm
Substrate Handling Size (minimum) 50mm (X) x 50mm (Y)
Substrate Handling Size (maximum) 400mm (X) x340mm (Y)
Options:460mm(X)x340mm(Y)
            510mm(X)x340mm(Y)
Cycle Time 7s
Screen Frame Thickness 20mm -40mm
Substrate Thickness 0.4mm -6mm
Print Pressure 0kg -20kg
Print Speed 1 -200mm/s
Print Gap 0mm -20mm
Substrate Separation Speed:0.1-20mm/sec
Distance:0mm - 20mm
Apply paste option Solder pastePrinting ink, Silver paste

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Company: Efficient Technology Co.,Ltd

Contact: Jacky

Tel: +8613714564591

Phone: +8613714564591

E-mail: sales@efsmt.com

Address: No. 4, Yangyong Industrial Zone, Shapu Community, Songgang Street, Baoan District, Shenzhen

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