SUNEAST SUNFLOW DS/450Z SUNFLOW DS/610Z Selective Wave Soldering Machine
Selective Soldering
Model:SUNFLOW DS/450Z
Double electromagnetic pump design， the efficiency increased by 1 times；
Double solder pots independent lifting；
Using German brand drip nozzle， with high precision；High efficiency and energy saving， top quality；Stable wave height， with low maintenance rate；Shows welding status in the whole time， nozzle spacing automatic adjustment.
Selective soldering SUNFLOW DS Feature:
High efficiency and energy saving，top quality;
Double solder pots independent lifting;
Display and record the whole process welding status;
Pioneered electromagnetic pump technology in China;
Nozzle spacing automatic adjustment.
Basic machine module：
|
Flux Module |
Preheat Module |
Soldering Module |
Conveyor System |
Soldering process:
Transport the PCB to flux module
Spray head move to programed area and flux is applied only to the soldering joint to be made
Top -side and bottom-side preheat
Programed electromagnetic pump soldering perfectly formed solder joint
PCB is transported out
Working Process:After PCB is moved to flux area,the spray head istargeted to the programed position and thefluxis applied only tothe solder jointto bemade.After preheating,the electromagnetic pumpmoves to the target areaand solder joint is made.
Product parameters
Specifications
Model NO.
SUNFLOW DS/450Z
SUNFLOW DS/610Z
General Parameters
Overalldimension(mm)(Not include indicator light andmonitor)
2710(L)*1930(W)*1630(H)
3040(L)*2240(W)*1630(H)
Equipment Weight(kg)
1650
2200
Max PCBsize(mm)
510(L)*450(W)
610(L)*610(W)
Min PCB size(mm)
120(L)*50(W
120(L)*50(W
PCB Top Side Clearance(mm)
120
120
PCB Bottom Side Clearance (mm)
60
60
PCB process edge(mm)
≥3
≥3
Conveyor Height From Floor (mm)
900±20
900±20
PCB Conveying Speed(m/min)
0.2-10
0.2-10
Max PCB Weight(kg)
≤8
≤8
PCB Thickness With Jig(mm)
1-6
1-6
Conveyor Width Adjustment Range(mm)
50-450
50-610
Conveyor Width Adjustment Mode
Electric
Electric
PCB Conveying Direction
Left to right
Left to right
Air Input Pressure(Mpa)
0.6
0.6
Max Air Consumption(m³/h)
5
5
Nitrogen Supply
Offered by customer
Offered by customer
Nitrogen Input Pressure(Mpa)
0.6
0.6
Nitrogen Consumption(m³/h)
1.5/single solder pot
1.5/single solder pot
Required Purity of Nitrogen(%)
>99.999
>99.999
Supply Voltage(VAC)
380
380
Frequency(HZ)
50/60
50/60
Max Power Consumption (kw)
<32
<38
Max Current(A)
<60
<64
Ambient Temperature(℃)
10-35
10-35
Machine Noise Level (dB)
<65
<65
Communication Interface
SMEMA
SMEMA
Soldering System
Max.Soldering distance of Xaxis(mm)
510
610
Max.Soldering distance ofY axis(mm)
450
610
Max.Soldering distance of Z axis(mm)
60
60
Nozzle outer diameter (mm)
5、6、8、9、10、12、14
5、6.8、9、10、12、14
Nozzle inner diameter (mm)
2.4、3、4、5、6、8、10
2.4、3、4、5、6、8、10
Max soldering wave height (mm)
5
5
Solder pot capacity (kg)
Approx.13kg(Sn63Pb)/solder pot
Approx.13kg(Sn63Pb)/solder pot
Approx.12kg(lead-free)/solder pot
Approx.12kg(lead-free)/solder pot
Max soldering temperature(℃)
330
330
Soldering heating power (kw)
1.15/solderpot
1.15/solderpot
Minimum distance between nozzle center of the two solder pots(mm)
95
95
Maximum distancebetween nozzle center of the two solderpots(mm)
230
310
Preheating System
Preheat temperature range(℃）
<200
<200
Heating power (kw)
17
21.5
Heating mode
Hot air+Infrared
Hot air+Infrared
Top side preheating
Hot air
Hotair
Spraying System
Max.stroke of Xaxis (mm)
510
610
Max.stroke of Yaxis(mm)
450
610
Spray height(mm)
60
60
Location speed(mm/s)
<400
<400
Spray head automaticallycleaning
Program control
Program control
Fluxbox capacity (L)
2
2
Jacky
Jacky