Yxlon Cheetah EVO SMT X-ray Inspection Machine

The Cheetah EVO is designed to meet the demands of Industry 4.0, enabling efficient and reliable inspection in the SMT and semiconductor industry as well as in laboratories.

Cheetah EVO highlights

Reliable, fast, and repeatable inspections – manually and automatically

Automatic void calculation with VoidInspect

Easy-to-use, dynamic enhancing filters, e.g., eHDR

Best available laminography with micro3Dslice and FF CT software

Dose reduction kit, dose monitoring, and low dose detector mode for sensitive components

Optional new water-cooled X-ray tube for a stable focal spot

Optional high load capacity (< 20 kg)

The optional water-cooled FXT 160.51 X-ray tube

Inspectors know the problem: long scan times often lead to image distortions and question test repeatability due to labile results. It's an effect caused by the rising temperature of the tube housing and the target, which can lead to focal spot drift. The new water-cooled X-ray tube counteracts this phenomenon. It provides reliable heat dissipation and ensures a stable focal spot and crystal-clear X-ray images even after long beam times. You achieve reliable inspection results for the first scan just as for the umpteenth and can rely on the repeatability of the X-ray inspection at any time.

See more of Cheetah EVO in the gallery:

 

Optimized automated X-ray and CT quality inspections

Cheetah EVO responds to the need for improved, automated operation with integrated workflows in the FGUI operating software. The Comet Yxlon FF CT software is designed to start automatically for faster reconstruction and visualization. It has a unique ability to render 3D cinematic images with a preset selection of transfer functions (TF), resulting in the most realistic, vivid visualization available today.

Future-ready to meet the demands of Industry 4.0

In today’s smart factory, everything revolves around connectivity and self-optimizing processes. Industry 4.0 demands for quality control systems that offer improved automated inspections and can become an integral part of the production line. Based on customer input, Comet Yxlon upgraded the Cheetah EVO system with advanced features that help manufacturers reach new heights in speed, image quality, reliability, and repeatability.

SMT inspections: grand performance for small devices

Due to the continuous miniaturization of electronic components, more and more features must fit in an ever-smaller area. For the most accurate and repeatable quality inspection results, a test system must not only provide high performance and resolution but also needs to be equipped with dynamic image enhancement filters. The Comet Yxlon Cheetah EVO features:

Large flat-panel detectors with up to 50% larger field of view for a better overview and faster working processes due to reduced steps in automated processes

Best laminography with micro3Dslice, with detailed 3D visualization for quick and easy failure analysis – resulting in substantial cost-savings compared to micro sectioning

Automatic void calculation with VoidInspect CL or DR, the laminography- or radiscopy-based inspection workflows enabling the rapid non-destructive analysis of voids inside the solder joints of board components

THTInspect DR, the semi-automated defect analysis for fill level inspections on THT-based components in 2D

Integration in the production line: ProLoop (Link auf Video weiter unten) allows direct communication with inline AOI / AXI inspection systems

Optional high load capacity (< 20 kg) with reinforced table and mechanics: Several parts and electronic interconnects in fixed packages can be inspected at once – a real-time saver

Void Inspection with VoidInspect CL

Cheetah EVO SMT applications

PCB

BTC

BGA

LGA

QFN/QFP

THT

IGBT

LED

Semicon inspections: maximum resolution at minimum voltage

Electronic components and semiconductor devices are the key elements of most electronic systems. Due to their compactness and density, testing requires maximal image resolution at low power and low voltage. Void compilations, including multi-area voiding, need accurate, repeatable inspection routines. The Comet Yxlon Cheetah EVO offers:

Highly sensitive detector with optional low dosage mode

High detail recognition through an integrated image chain

Integrated, automatic defect detection with FGUI (e.g. voids in bumps)

CT scan of BGAs and Bond wiresCheetah EVO semiconductor applications

Cheetah EVO semiconductor applications

Wafers and integrated circuits (IC)

Die attach connections

3D IC joints

TSV

Sensors

MEMS and MOEMS

Laboratory inspections: leading technology for precise analysis

The inspection of electronic components during research and development is highly complex and requires a broad range of features. Computed tomography with the Comet Yxlon Cheetah EVO is the technology of choice for detailed analyses of micro components such as those used in batteries, connectors, and medical devices.

Exceptional CT quality due to a range of highly sensitive detectors with excellent contrast-to-noise ratio

Realistic, vivid visualization by Comet Yxlon FF CT software, integrated with the FGUI user interface workflows with individual 3D cinematic renderers, artifact reduction, and a preset selection of transfer functions (TF)

CT scan of BGAs (Ball Grid Arrays)

Cheetah EVO lab applications

Batteries

Connectors

Various hard-to-see electronics components

Medical material

Military and space electronics

Production line integration with ProLoop

ProLoop is Comet Yxlon’s smart factory solution for the optimization of production processes. It enables direct communication with the inline AOI / AXI inspection systems and thus helps achieve maximum yield performance.

Technical Data

Sample Size	800 x 500 [mm] (31'' x 19'')
Max. Radioscopic Area	460 x 410 [mm] (18'' x 16'')
System Dimensions (W/D/H)	1650 x 1400 x 2050 [mm]
System Weight	2200 kg
FeinFocus X-ray Tube	FXT-160.50 Microfocus or FXT-160.51 Multifocus, 20 - 160 kV voltage range
Pixel Matrix	1004 x 620 px (Flat-panel detector 1308), 1004 x 1004 px (Flat-panel detector 1313), 1276 x 1276 px (Flat-panel detector 1616)
Pixel Pitch	127 µm
Bit Depth	16 bit
Oblique Viewing	+/- 70° (140°)
3D Modes	Laminography (micro3Dslice), CT QuickScan, QualityScan