Yamaha YSH20 flip chip bonder machine

4,500 UPH (0.8 sec/unit)
+/- 10 µm (3σ) mounting accuracy (When using Yamaha’s standard components)
YWF wafer supply unit “6/8/12 inch”, “expand ring”, and “0 angle correction” applicable
0.6 × 0.6mm to 18 × 18mm components applicable

BASIC INFO

Yamaha YSH20 flip chip bonder machine

Applicable PCB: L250 x W200mm

Mounting Capability: [2F2F heads & multi-camera type] 4,500 UPH (0.8 sec/unit) ** excluding dipping 3,600 UPH (1.0 sec/unit) ** including dipping
[4M4M heads & multi-camera type] ** under development 5,500 UPH (0.65 sec/unit) ** excluding dipping 4,500 UPH (0.8 sec/unit) ** including dipping

Applicable Components : [Multi-camera] Flipchip: 0.6 x 0.6mm to 18 x 18mm Bump diameter 60μm or more Bump pitch 110 μm or more, Height 0.7mm or less
SMD Chip: 0402 (Metric base) to 20 x 20mm, Height 6mm or less

Accuracy ): [2F2F heads & multi-camera type]
Repeatability (3): +/- 0.010mm/unit +/- 0.05 degree

Model	YSH20
Applicable PCB	L50 x W30mm to L250 x W200mm
Applicable PCB	** “Up to L340 x W340mm” is applicable. Please contact us separately.
Mounting Accuracy (When Using Yamaha’s Standard Components)	[2F2F heads & multi-camera type]
	Repeatability (3): +/- 0.010mm/unit +/- 0.05 degree
	[4M4M heads & multi-camera type] ** under development
	Repeatability (3): +/- 0.010mm/unit +/- 0.05 degree
Mounting Capability (Under Optimum Condition)	[2F2F heads & multi-camera type] 4,500 UPH (0.8 sec/unit) excluding dipping 3,600 UPH (1.0 sec/unit) including dipping
Mounting Capability (Under Optimum Condition)	[4M4M heads & multi-camera type] under development 5,500 UPH (0.65 sec/unit) excluding dipping 4,500 UPH (0.8 sec/unit) ** including dipping
Component Supply Configuration	Wafer (6/8/12 inch flat ring), waffle tray, tape reel (8/12/16 mm width)
Applicable Components	[Multi-camera] Flipchip: 0.6 x 0.6mm to 18 x 18mm Bump diameter 60μm or more Bump pitch 110 μm or more, Height 0.7mm or less
Applicable Components	SMD Chip: 0402 (Metric base) to 20 x 20mm, Height 6mm or less
Power Supply	3-phase AC 200/208/220/240/380/400/416V +/- 10% 50/60Hz
Air Supply Source	0.5 MPa or more, in clean, dry state
External Dimension	L1,400 x W1,820 x H1,515mm (main unit only)
** Excluding Projections	L1,400 x W2,035 x H1,515mm (when YWF wafer supply unit is installed)
Weight	Approx. 2,470kg (main unit only)
Weight	Approx. 2,780kg (when YWF wafer supply unit is installed)
* Specification and appearance are subject to change without prior notice.