VISCOM iX7059 One 3D AXI SMT X-ray Inspection Machine

iX7059 One – The ONE ideal inspection system for your advanced assembly, power module and semiconductor production.

In the pursuit of excellence, precision is non-negotiable. With the iX7059 One, precision is not just a goal; it is a guarantee. Equipped with state-of-the-art imaging capabilities, this system delivers unrivaled image quality down to an astonishing 1μm resolution. From intricate semiconductor devices to complex leadframe applications, every detail is captured with breathtaking clarity.

But precision extends beyond mere image quality. Its about the ability to identify and address defects with unwavering accuracy. Here, the iX7059 One shines brightest, boasting a greater depth of field that sets a new benchmark in defect detection. Whether it is a subtle flaw or a glaring imperfection, rest assured that nothing escapes the meticulous gaze of this advanced inspection system.

What sets the iX7059 One apart is its versatility. With X-ray Inspection capabilities spanning 2D, 2.5D, and 3D, it is equipped to handle the diverse needs of modern manufacturing. From single semiconductor devices with intricate internal structures to leadframe applications requiring comprehensive analysis, this system delivers flexibility from standalone to unparalleled 100 % inline inspection for production performance across the

ADVANTAGES AT A GLANCE

Resolution down to 1 μm

Detects voids/cracks early in manufacturing process

Robust system design

Can be used for both standalone and 100% inline applications

Leadframe and carrier variants

Works seamlessly with standard interfaces

Long-term investment security

It's a test image of the product Viscom iX7059 one which reflects the high resolution.

It's a test image of the product Viscom iX7059 one which reflects the high resolution.

It's a test image of the product Viscom iX7059 one which reflects the high resolution.

HIGHLIGHTS

Resolution down to 1 μm for extremely accurate measurements

Set a new benchmark in quality assurance with an extended depth of field

Ultra precise X-ray inspection in real 2D, 2.5D and 3D

From RnD to inline inspection („Lab-to-Fab“)

Tailored for semiconductor devices, leadframe applications, and advanced assembly products.

Modern operating software for extremely fast programming and incredibly simple verification

Maximum inspection program optimization through integrated verification

Service, hotline support and remote maintenance worldwide

CONNECTIVITY

Global libraries, global calibration: transferability to all systems

Automated grayscale value calibration for consistent inspection results

Traceability, statistical process control, offline programming, multiline verification

Viscom Quality Uplink: effective networking and process optimization

Interfaces: SMEMA, SECS/GEM, IPC Hermes Standard (optional)

INSPECTION

Solder bump inspection, microcracks, void analyses, leadframe inspection, solder layer quality, cold solder joints, solder joint morphology, HiP for solder bumps, wirebond defects, advanced packaging applications