VISCOM iS6059 3D SPI Machine

Z Resolution:.1 µm
Detection speed：Up to 80 cm²/s
PCB (Printed Circuit Board) Size:：508 mm x 508 mm (20" x 20")
Field of view:：58 mm x 58 mm

BASIC INFO

VISCOM iS6059 3D SPI Machine

Viscom’s powerful SPI system inspects solder paste application in SMD production with maximum speed and precision. 3D features, such as volume, height, and shape as well as surface area, displacement, and smearing are accurately examined. The 3D inline system demonstrates decades of Viscom's experience in reliable, high-throughput solder paste inspection. The latest sensor technology with an orthogonal camera and four lateral views results in the highest inspection quality. Realistic color images ensure quick and clear verification. The FastFlow handling guarantees an extremely high throughput thanks to synchronous in- and outfeed of the assemblies. The system can achieve minimal handling times with minimal mechanical impact loads. Intelligent networking in the SMT line enhances process stability and efficiency.

ADVANTAGES AT A GLANCE

Latest 3D camera technology

Ultra-fast inspection – also with dual-lane operation

Shadow-free, seamless solder paste inspection

Closed loop functions with solder paste printer and pick-and-place machine

Effective process control and optimization in real time

Color-assisted 3D solder paste volume calculation

Paste bridge after soldering

3D solder paste volume calculation with grid pattern

User-friendly overviews in vVision

HIGHLIGHTS

Excellent defect identification for ultimate reliability

Cutting-edge 3D camera technology

High inspection speed

Fast handling of PCBs

End-to-end process analysis with Viscom Quality Uplink

Closed-loop functions enhance quality and efficiency

Integrated verification

Flexible integration into existing productions

Improved ergonomic design

CONNECTIVITY

Global libraries, global calibration: transferability to all systems

Traceability, offline programming, statistical process control

Viscom Closed Loop: Intelligent communication between Viscom inspection systems and the paste printer and placement machine

Independent real-time image processing with Viscom analysis tools

Simple process analysis

Optional connection to the digital multi-purpose platform vConnect

INSPECTION

Inspects solder paste deposits (pad sizes of 01005 components) and dispenser paste for surface, height and shape

Defects/defect features: too much/too little solder, missing solder, print displacement (X/Y offset), paste smearing

Optional: coplanarity, open area analysis, OCR, DMC

Specifications
size
System Shell:	997 mm x 1756 mm x 1753 mm
	(39.3" x 69.1" x 69") (W x L x H)
Camera Technology	XM Solder Paste Inspection
3D sensor technology
Z Resolution:	.1 µm
Z Range:	Max. 5 mm(.2")

Tilt-angle camera
Megapixel Camera:	4

Right angle camera
Resolution:	12 µm
Field of view:	58 mm x 58 mm（2.2" x 2.2"）

Detection speed	Up to 80 cm²/s

deal with
PCB (Printed Circuit Board) Size:	508 mm x 508 mm (20" x 20")

software
user interface:	Viscom vVision
Statistical process control:	Viscom vSPC / SPC, open interface (optional)
Verify the repair station:	Viscom vVerify
Remote Diagnosis:	Viscom SRC (optional)
Programming Station:	Viscom PST34 (optional)