TRI TR7700QM SII AOI Machine

Max. 3D Range:20mm
Imaging Speed：Up to 7.7 cm²/sec
Max PCB Size：400 x 330 mm
Max PCB Weight：3kg

BASIC INFO

TRI TR7700QM SII AOI Machine

The TR7700QM SII is built on a high accuracy platform with 5.5 µm high resolution 12 MP imaging technology for the Semiconductor & Packaging industry. The Stop-and-Go 3D AOI is able to inspect wire bonds, die bonds, SMD, bumps, and solder joints. The Smart 3D AOI solution's accuracy is enhanced with metrology capabilities and flexible inspection algorithms.

Features

• Semiconductor and Packaging technology Inspection.

• 5.5 μm Resolution for Ultra-High Precision Metrology-grade Inspection
• Ready to Inspect in Minutes with TRI's Smart Programming
• Multiple 3D Technologies for Full coverage Inspection

Specification

Imaging Method	Stop-and-Go
Top Camera	12 MP High Speed Camera
Angle Camera	N/A
Imaging Resolution	5.5 μm
Lighting	Multi-phase True Color LED, Coaxial Lighting
3D Technology	Quad Digital Fringe Projectors
Max. 3D Range	20 mm
Inspection Performance
Imaging Speed	Up to 7.7 cm²/sec
Motion Table & Control
X-Axis Control	Ballscrew + AC Servo with Motion Controller
Y-Axis Control	Ballscrew + AC Servo with Motion Controller
Z-Axis Control	Ballscrew + AC Servo with Motion Controller
X-Y Axis Resolution	1 μm with Optional Linear Encoder
Board Handling
Max PCB Size	400 x 330 mm
PCB Thickness	0.6 - 5mm
Max PCB Weight	3 kg
Top Clearance	20 mm
Bottom Clearance	40 mm
Edge Clearance	3 mm. Optional: 5 mm
Conveyor	880 - 920 mm
Inspection Functions
Component	Missing, Tombstoning, Billboarding, Polarity, Rotation, Shift, Wrong Marking (OCV), Defective, Upside Down, Extra Component, Foreign Material, Lifted Component
Solder	Solder Fillet Height, Solder Volume %, Excess Solder, Insufficient Solder, Bridging, Through-hole Pins, Lifted Lead, Golden Finger Scratch/ Contamination
Dimensions
WxDxH	1000 x 1460 x 1650 mm

	Note: not including signal tower, signal tower height 515 mm
Weight	785 kg