Panasonic HT122 Pick and place machine

Mounting speed: 0.066s/chip (varies by component)
Mounting accuracy :50 um/30
Component size: 0603 chip ~L24mxW24m, QFP, BGA, CSP

BASIC INFO

Panasonic HT122 Pick and place machine
From tiny components to BGA and CSP, the mounting accuracy is further improved
The mounting accuracy of 50um/30 is achieved through the lightweight of the high-rigidity cast frame and mounting head with excellent vibration resistance, as well as the low vibration of the turret mounting head and XY table.
High quality mounting is achieved by controlling the mounting height of components with a high-precision linear sensor. The timing of mounting is switched according to the nozzle and the mounting speed, and the mounting is carried out under the best conditions to improve the mounting quality. Using large field of view/small field of view recognition camera, reflection · pass and use component recognition, coaxial reflection lighting, high-precision identification of 0603 tiny components to L24mxW24mm QFP, then mount
Features
That corresponds to an increase in productivity
The maximum speed of 0.066s/ chip (54,500cph) is achieved by using 18 mounting heads (6 mouthpieces)
XY workbench high speed, improve productivity.
Braid material rack adopts package braid overall disassembly cover to shorten component exchange time.
The double braid rack can carry up to 300 stations.
The braid rack (IPC*) equipped with memory can automatically identify components and reduce equipment stop loss time.
The rotating magnet (RM) type of bulk rack can provide high-speed and stable supply components to achieve long-term continuous operation