OMRON VT-X950 3D X-ray Inspection Machine

The X950 is the first in the VT series to support clean rooms for mid-process semiconductors where wafer-to-wafer bonding processes occur. It is also equipped with a function that automatically changes inspection settings to accommodate sudden changes in production items due to fluctuating demand. The system automatically changes conditions by referencing measurement points and inspection settings registered in advance in the production control system that are appropriate for each production item. This reduces start-up losses and re-setting of inspection settings.

Ultra-microfocus X-ray source 

Equipped with a conveyor-based automatic loading/unloading function, contributing to automation and manpower saving in the manufacturing process

Supports clean room and automatic setting change

Technology to capture stereoscopic images without stopping

Bump electrodes formed with a narrow pitch to bond IC devices together

The system uses AI technology to determine whether a product is good or defective by processing captured images using deep learning

Resolution down to 0.2 μm/Pix

 OMRON VT-X950 is a CT-type automatic X-ray inspection system. It is designed to meet the increasingly complex demands of semiconductor manufacturing and other advanced industries. The VT-X950 stands is OMRON's first model in the VT series specifically designed to support clean rooms, making it ideal for mid-process semiconductor environments, such as wafer-to-wafer bonding processes. Read more:

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