KOH YOUNG KY8080 SPI Machine

Min component: 01005
PCB size:350x330mm
Dimension:1000x1335x1627mm
weight:600kg

BASIC INFO

KOH YOUNG KY8080 SPI Machine

The KY-8030 is an in-line, fully automated SPI system that uses patented Koh Young shadow-free inspection technology and software to deliver 100% 3D inspection of solder paste.

• True patented 3D volume measurement

• No false calls – no escapes – no shadow problems

• Highest accuracy and repeatability

• No PCB color sensitivity

• Solder paste printing optimization - at its best

• Lower initial investment

• Low cost of ownership, fast ROI

• Shortest programming time

• Accurate, powerful SPC tool package

In-line SPI with no compromises KY-8030 is designed for manufacturers who need in-line SPI with no compromises in high precision and accuracy. With KY-8030, you buy the throughput capability that you need

KY-8030 is a process optimization tool built with world-class Koh Young quality components and engineering. It’s the perfect complement to your manufacturing line, where precise, accurate, repeatable results cannot be compromised. The KY-8030 is an in-line, fully automated SPI system that uses patented Koh Young shadow-free inspection technology and software to deliver 100% 3D inspection of solder paste. Superb Performance and Value in Automated 3D SPI

Medium-volume users will appreciate KY-8030’s rugged dependability and all the benefits of in-line 3D SPI but at a lower initial investment. It delivers superior value to the customer because it will out-perform costly competitive systems that don’t offer true 3D SPI.

Inspection Range
Metrology Capability	Volume, Area, Height, Offset, Bridging and Shape Deformity
Types of Defects	Insufficient/Excessive/Missing Paste, Bridging, Shape Deformity and Paste Offset
Measurement Principle	3D Shadow Free Moiré
Camera Technology
Camera	2MPix
	XY Pixel Resolution: 20 µm 0.79 mils
	Z Resolution: 0.37 µm 0.015 mils
Inspection Speed	Shadow Free Mode:15.0 cm2/sec 2.33 sq. inch/sec
at 20 um	High Speed Mode: 19.7 cm2/sec 3.05 sq. inch/sec
Volume Repeatability	< 1% at 3sigma (on a KY Calibration Target)
Volume Repeatability	< 3% at 3sigma (on a PCB)
Height Accuracy	2mm
Gage R&R	< 10 % at 6Sigma (± 50 tolerance)
Max. PCB Warp	± 3.5 mm
Max. Paste Height	400um 15.75 mils
Min. Paste Deposit Size at 20um	Rectangle: 150um 5.91 mils
Min. Paste Deposit Size at 20um	Circle Min: 200um 7.87 mils
Distance between Paste Deposit	100 mm (at 150 mm paste height) 3.94 mils (at 5.91 mils paste height)
PCB Handling
Conveyor Width Adjustment	Automatic
Conveyor Fix Type	Front/Rear Fixed (Factory Setting)
Conveyor Height	970 ~ 870 mm 38.19 ~ 34.25 inch
System & Installation requirements
Supply	Electrical 200 ~ 240VAC, 50/60 Hz Single phase
Supply	Air: 5 Kgf/cm2
Operating System	Windows XP Professiona
S/W
Statistical Analysis Tool	SPC Plus
Inspection Program Generation	Import GERBER Data (274X, 274D)
Options	Zoom Head (15, 20, 30 mm Autozoom)
	Off-line SPC & Defect Review Station
	Off-line Programming Station ODB++ File Conversion
	Barcode Reader (1D/2D) HDD Raid 1 (Mirrored)
	Certified Calibration Target UPS
Above specifications are subject to change whithout notice.