Heller 1826 MK5 Reflow Oven 8 heated zones

16 Heating Modules (8 Top Modules, 8 Bottom Modules)
2 Cooling Zones
Maximum Conveyor Speed: 188 Cm/Min
Standard PCB Size: 508 Mm

BASIC INFO

Heller 1826 MK5 Reflow Oven 8 heated zones

Convection Reflow Oven providing consistent performance for high volume requirements while minimizing preventative maintenance and floorspace

1 Lead Free Certified Convection Reflow Oven!

2 Maintenance Free!

3 Lowest Nitrogen & Electrical Usage!

4 Integrated Cpk software at No Charge!

See our newest reflow oven. The breakthroughs associated with the MK5 convection reflow oven now provide you with an even lower cost-of-ownership. Heller’s new heating and cooling advances deliver up to 40% reduction in nitrogen and electrical consumption. This makes the MK 5 system not only the premier reflow soldering machine system but overall the best convection reflow oven value in the industry!

Features & benefits of the Mk5 series SMT convection reflow oven system

New Cool Pipe Flux System Virtually Eliminates Maintenance

Our new Cool Pipe flux collection system traps the flux in collection jars that can easily be removed and replaced while the convection reflow oven is running – thus saving time consuming P.M. Additionally, our proprietary Flux-Free Grill System limits flux residue on the cooling grills – the result is not only reduced maintenance time, but recaptured production time – giving the Heller convection reflow oven system the highest production yields of any reflow oven!

NewEnhanced Heater Modules

Enhanced flow heater modules with 40% larger impellar, blanket the PCB with heat for the lowest delta Ts on the toughest boards! Additionally, the Uniform Gas Management system eliminates net flow which results in nitrogen consumption reductions of up to 40%!

One-Step Profiling

Developed in partnership with KIC, you can now have instant profile settings by simply entering the length, width and weight of your PCB. An extensive profile and paste library with dynamic structure does the rest of the work for you!

Fastest Cooling Rates

The new Blow Thru Cooling module provides cool rates of >3º C/sec – even on LGA 775! That rate meets even the most demanding lead-free profile requirements!

Process Control

Powered by ECD, this innovative software package provides three levels of process control from Oven CpK, to Process CpK and Product Traceability, this software ensures that all parameters are optimized and SPC reporting is fast and easy.

Energy Management Software – A Heller Exclusive!

Proprietary software allows you to program exhaust draw to optimize energy consumption during the various reflow oven soldering production times – heavy, light or idle.

- Suitable Heating Technologies For Lead-Free Wave Soldering Processes

- Temperature Adjustment Range: 60o-350o

- Max Temperature: 450°

- Lifetime Guarantee In Motors And Heaters

- 16 Heating Modules (8 Top Modules, 8 Bottom Modules)

- Standard PCB Size: 508 Mm

- Forced Hot Air Convection

- Maximum Conveyor Speed: 188 Cm/Min

- Temperature Accuracy: +/- 1°

- 2 Cooling Zones

- Option to operate with nitrogen

- Dimenions (mm): 4.650 (L) x 1.570 (W) 1.600 (H)