ERSA POWERFLOW Wave Soldering Machine
Technology Highlights
wave soldering system POWERFLOW
Powerful wave soldering system with attractive price/performance ratio
Modular, flexible and individually expandable preheating concept - can be configured variably in terms of length and output (can also be retrofitted)
Monitoring and documentation of all process-relevant data > ready for traceability
Technical data
wave soldering system POWERFLOW
Dimensions
Length: from 4,200 to 4,950 mm Width: approx. 1,515 mm |
Height: approx. 1,565 mm Weight: 2,200 to 3,000 kg |
Conveyor systems
Finger transport Max. conveyor speed 2.5 m/min |
Max. working width up to 508 mm Max. PCB top side clearance up to 120 mm |
Preheating / Solder module
Preheat module bottom-side: Dynamic short-wave emitter - max. 10.4 kW (power controlled) Medium-wave emitter, max. 6 kW (controlled) Dimensions: 600 mm length each |
Solder module: Capacity: ca. 9,8 kW Solder volume: approx. 820 kg lead-free alloy
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