DESEN DGL-E Solder paste printer

Automatic stencil positioning

Automatic platform calibration

Maxim printing size:850*610mm

PCB 2D  inspection

Flexiable side clamping

Vacuum adsorption of substrate

Application Scenario

5G

Semiconductor

3C Products

Photovoltaic Products

New Display

Automotive Electronics

Medical Treatment

New Energy

Product Advanced Options

The sensor will detect the diameter of solder paste remained under the front squeegee to remind the opreator to supply paste.

Automatic Supply Solder Paste
It's controlled by electricity and also capable for supplying the solder paste atfixed times.

Stencil Aperture Inspection
Stencil aperture inspection can be programmed to be carried out automaticallyto detect clogging on stencil opening, eliminate poor printing from the begining.

Automatic Dispensing Unit
Attached on CCD Camera XY axis, the dispenser provides basic function of gluedotting using syringe type dispensing needle after solder paste printing.

UPS
It will keep the power supply to PC for 10 minutes after power off to protect theproduction data.

Temperature&Humidity Control System
There are 3 options for this function:
T&H both are controlled.
Temperature control&Humidity detect.
T&H both detect and display.

Industry 4.0
Customize the different communications modes of customers to realizeintelligent operation management.
Product output and manufacturing data analysis and statistics in real-time.
Intelligent alarm & prompt system and processing solution.
Bar-code recognition.

Product Parameter