Yamaha S10 3D Hybrid Modular Pick and Place Machine

Placement Speed : 45,000CPH
Applicable PCB : 420*510mm
Applicable Part : 0201mm–120x90mm
Accuracy: ±0.04mm/chip

BASIC INFO

Yamaha S10 3D Hybrid Modular Pick and Place Machine

Ultimate Flexibility to realize 3D MID* Placement

1. Enhancement to 3D MID

2. Large board handling capability

3. Wide ranging component handling capability and high feeder capacity

4. Ultimate flexibility and fast & easy setup

* 3D MID: Molded Interconnect Device

3D hybrid placement functions

Dispense heads that can be exchanged with mount heads are newly developed. It becomes possible to make 3D placement where solder paste dispensing and component mounting can be alternately performed. Hybrid placement is now realized. The removable Dot Station can be fitted to the feeder bank.

Enhancement to 3D MID

3D MID mounting (*Custom-order specification)

Newly developed models for which dispense and placement not only on standard PCB but also on concave-convex, tilting and curved surface are also to be realized. To ensure the machine for 3D MID applications such as automotive, medical and telecommunications in future, machine structures required have already been arranged accordingly.

Large board handling capability

Multi-Conveyor system

Utilizing a laser sensor to measure the board length, providing optimum board position for efficient component placement, regardless of size or shape, for various production styles.

Long board handling capability

Maximum length of one-time clamp : 1,240mm

Wide ranging component handling capability and high feeder capacity

Max. feeder capacity 180 lanes

S20 : S20 Max. 180 types (8mm tape conversion), 45 lanes x 4

S10 : S10 Max. 90 types (8mm tape conversion), 45 lanes x 2

ANC station

Nozzle ID automatically recognized. The standard ANC station can accommodate 24 nozzles. As a variation, an optional ANC station that can accommodate 40 nozzles is also available.

Wide ranging component handling capability

0201mm ultra-tiny chip (option) up to max. 120 x 90mm components can be handled by a single standard camera. Max. component height is 30mm (component height + board thickness), the greatest class on the market.

Color fiducial camera

Great upgrades in fiducial recognition performance! These include colorizing for fiducial recognition cameras and a newly developed lighting unit. Robust coating inspections are now a reality. (To be customized)

New head unit for higher speed placement

12-axis 2-theta head unit

Newly developed for higher speed placement is best suited for a long board production such as LED lighting.

6-axis 2-theta head unit

The 6-axis 2-theta head ideal for hybrid mounting tasks achieves the ultimate 1-head solution for mounters covering the process from dispensing to mounting to inspection.

Ultimate flexibility and fast & easy setup

CFB/CTF full compatibility

The newly developed CFB-45E as well as the existing CFB’s and CTF can be all used together on the M10 and M20 as well as on the S10 and S20.

Applicable CFB and CTF

1. F3 45-lane Feeder Bank Changer “CFB-45E”

2. F3 36-lane Feeder Bank Changer “CFB-36E”

3. Changeable Tray Feeder “CTF-36C”

※Fitted to S20 on the pictures below.

1. 6 axis 2-theta head	15. FTF-36C Cassette type Fixed Tray Feeder
2. Air pulse type dispense head	16. RTS-1 Removable Tray Station
3. Screw pump type dispense head	17. Parts feeders
4. ANC40	18. Rear side operation system
5. 0201mm chip handling capability	19. Rear side switches
6. Dispensed dot check function(To be customized)	20. UPS4
7. 3D-MID	21. Conveyor extension, entrance/exit
8. Rear fixed multi-scan camera	22. Component setup verifier
9. F3 / F1 / F2 Rear side fixed feeder bank	23. Feeder relocatability
10. F3 45-lane fixed feeder bank	24. Waste tape box
11. Safety cover, front/rear	25. Internal lighting
12. Clamp unit for CFB/CTF	26. Lead coplanarity sensor
13. CFB-36E / CFB-45E F3 Electric Feeder Bank Changer	27. Offline software
14. CTF-36C Cassette type Changeable Tray Feeder	28. iQvision

Model	S10	S20
Board size(with buffer unused)	Min. L50 x W30mm to Max. L1,330 x W510mm (Standard L955)	Min. L50 x W30mm to Max. L1,830 x W510mm (Standard L1,455)
Board size(with input or output buffer used)	Min. L50 x W30mm to Max. L420 x W510mm	-
Board size(with input and output buffers used)	Min. L50 x W30mm to Max. L330 x W510mm	Min. L50 x W30mm to Max. L540 x W510mm
Board thickness	0.4 - 4.8mm	0.4 - 4.8mm
Board flow direction	Left to right (Std)	Left to right (Std)
Board transfer speed	Max 900mm/sec	Max 900mm/sec
Placement speed (12 heads + 2 theta) Opt. Cond.	0.08sec/CHIP (45,000CPH)	0.08sec/CHIP (45,000CPH)
Placement accuracy A (μ+3σ)	CHIP +/-0.040mm	CHIP +/-0.040mm
Placement accuracy B (μ+3σ)	IC +/-0.025mm	IC +/-0.025mm
Placement angle	+/-180 degrees	+/-180 degrees
Z axis control / Theta axis control	AC servo motor	AC servo motor
Component height	Max 30mm*1 (Pre-placed components: max 25mm)	Max 30mm*1 (Pre-placed components: max 25mm)
Applicable components	0201mm – 120x90mm, BGA, CSP, connector, etc. (Standard 01005 -)	0201mm – 120x90mm, BGA, CSP, connector, etc. (Standard 01005 -)
Component package	8 - 56mm tape (F1/F2 Feeders), 8 - 88mm tape (F3 Electric Feeders), stick, tray	8 - 56mm tape (F1/F2 Feeders), 8 - 88mm tape (F3 Electric Feeders), stick, tray
Drawback check	Vacuum check and vision check	Vacuum check and vision check
Screen language	English, Chinese, Korean, Japanese	English, Chinese, Korean, Japanese
Board positioning	Board grip unit, front reference, auto conveyor width adjustment	Board grip unit, front reference, auto conveyor width adjustment
Component types	Max 90 types (8mm tape), 45 lanes x 2	Max 180 types (8mm tape), 45 lanes x 4
Transfer height	900 +/- 20mm	900 +/- 20mm
Machine dimensions, weight	L1250xD1750xH1420mm, Approx. 1,200kg	L1750xD1750xH1420mm, Approx. 1,500kg