VISCOM iS6059 Dual Lane 3D AOI Machine

System housing:1100 mm x 2006 mm x 1753 mm
Z-resolution:0.5 µm
Resolution:10 µm
PCB dimensions: 450 mm x 350 mm (17.7" x 13.8")

BASIC INFO

VISCOM iS6059 Dual Lane 3D AOI Machine

iS6059 Dual Lane Variants – High-Speed System for Dual-Track Production

The iS6059 Dual Lane Variants Inspection combines the advantages of special high-speed 3D sensor technology with excellent inspection quality and extremely fast inspection speed. The 3D AOI system, which was developed for the economical large-scale production of assemblies, reliably inspects both components and solder joints. Within the manufacturing process, it can be intelligently networked for Industry 4.0 applications.

Advantages at a glance

Inspection on two lanes at the same time

Any options you would get with the single lane equivalents are available here, as well

IPC-compliant 3D assembly inspection

Designed specifically for cost-effective mass production

Meets the most demanding cycle time requirements

Integrated verification for fewer false calls

Inspection scope

Realistic inspection images with 360View

Reliable detection of defects such as tombstoning

3D solder joint measurement

Component body detection using 3D methods

Height profiles of THTs

Insufficient wetting (front) and missing pin (back)

Reliable 3D pin length inspection

3D quality control of THT solder joints

HIGHLIGHTS

Inspection on two lanes at the same time

Any options you would get with the single lane equivalents are available here, as well

Robust system design

Verified zero defect slippage thanks to integrated verification

Flexible integration into existing productions

Improved ergonomic design

CONNECTIVITY

Global libraries, global calibration: transferability to all systems

Intelligent software add-ons such as integrated verification or Viscom Quality Uplink for effective networking

Traceability, offline programming, statistical process control

Communication with MES systems

Independent real-time image processing with Viscom analysis tools

High-performance OCR software

optional connection to the digital multi-purpose platform vConnect

INSPECTION

Components: up to 03015 and fine-pitch components

Solder paste, solder joint and assembly control

Defects/defect features: excessive/insufficient solder, missing solder/solder skip, component missing, component offset, wrong component, component damaged, component overpopulated, billboarding, component on back, damaged pin, bent pin, solder bridging/short circuit, tombstoning, lifted lead, soldering defects, nonwetting, contamination, polarity error, rotation, imperfect shape

Optional: free area analysis, color ring analysis, wobble circle error, OCR, blow holes in the solder joint, solder ball/solder sputter

SMT Inspection Equipment Brand