UNICOMP AX9500 CT SMT X-ray Inspection Machine
Fully upgraded new products, can perform CT detection on BGA, CSP, flip chips, LEDs and other semiconductors, can also be used for SMT welding analysis, 3D tomography CT scanning system (planar CT + cone beam CT)
Applications
BGA、CSP、Flip Chip、LED Chip
Soldering Analysis
Automotive Devices, Battery Industry
Aluminum Die Casting, Molding Plastics
Ceramics, Other Dedicate Industries
Function Features
160kV open tube, 1µm focus spot
High resolution with Max detection area FPD
3D CT scanning system（Planar CT + Cone beam CT）
7 axis motion system, 360 degrees inspection
CNC programming with high accuracy and repeatability
High Definition navigation system
Easy tracking function with different angles
X-Ray images
Dimensions and Appearance
System Parameters
Footprint Size
1560(W)*1830(D)*1900(H)mm
Machine Weight
≈3700kg
Max.Tube Power
64W
Max.Target Power
15W
Max.Voltage / Current
160kV/1000μA
X-Ray Leakage
<0.5μSv/h
Imaging System
X-Ray Tube Type
Open tube
Resolution
1 μm
Detector
FPD
System Magnification
2500X (combined 7500x)
Inspection Capbility
Maximum load size (2D/2.5D)
580(X)mm×610(Y)mm
Maximum Inspection Size(2D/2.5D)
540(X)mm×570(Y)mm
Maximum Load Size (CT):
Planer CT: 470(X)mm×500(Y)mm
Core-beam CT: 100(X)mmx200(Y)mm
3D Imaging Time
45s
Maximum Sample Weight
10kg（Planer CT）
0.5kg（Cone-beam CT)
Jacky
Jacky