UNICOMP AX8500 SMT X-ray Inspection Machine

Widely applied for BGA , CSP , Flip Chip, LED , Fuse,Diode, PCB, Semiconductor, Battery Industry, Small Metal Casting, Electronic Connector Module, Cables, Photovoltaic Industry, etc.

Application Fields

Functions and Feature

Inspection Images

Dimensions and Appearance

System Summary
Footprint	1340(W)×1450(D)×1795(H)mm
Machine Weight	1700 kg
Power Supply	AC 110~220V, 50/60Hz
Plywood Packing Size	1600(W)×1600(D)×2000(H)mm
Packing Weight	1920 kg
Power Consumption	1.5kW
X-Ray Tube
Tube Type	Sealed
Max. Power	25W
Voltage	0~110kV (Adjustable)
Focus Spot Size	5μm
Imaging System
Detector	Flat Panel Detector (FPD)
Pixel Size	84μm
Effective Detection Area	129*129mm
Frame Rates	20fps
Pixel Matrix	1536*1536
System Magnification	1000X
Software
Auto-measuring	BGA Soldering Voids Auto-measuring and Support Data/Graphic Output
Multiple Measuring Tools	Support Measuring Distance, Angle, Diameter, Polygon, PTH filling rate, etc.
CNC Mode	CNC Programmable Inspection, Easy Operation and User Friendly
Real-time Display	Real-time Displaying the Working Data of Voltage, Current, Angle, Date, etc
Navigation	Convenient Target Point Positioning System
Motion Control System
Movement Control	Joystick, Keypad & Mouse
Max. Loading Area/Weight	Ф570mm / 10kg
Max. Inspection Area	450*450mm
Oblique Views	Max. 55° Filting (FPD) / 360° Rotation (Table)
Manipulator	6-axis with X1 / X2 / Y / Z1 / T (55°) /R (360°)
Industrial PC
Monitor	21.5’’ FHD LCD Display
System OS	Windows 10 64bit
Hard disk	1TB
RAM	8GB
CPU model	Intel i7 Processor
Other Features
Energy Saving	X-Ray Auto-off when it's out of work over than 5 minutes
Safety Operation	Electromagnetic Interlock and warning Light
Authority Management	Password Management
X-Ray Safety	<1μSv/h (Meets All International Standards)
* Specifications are subject to change without notice, All trademarks are the property of the system maker.