SKAI 3Di-MS3 M size 3D AOI Machine

Size[Main body] (W) x (D) x (H) mm (in.)：850×1430×1500 (33.46 x 56.30 x 59.06)
Resolution：8μm、15μm
PCB Clearance mm (in.)：Top: 40 (1.57) Bottom: 60 (2.36) *1
PCB Size：50 x 60 – 330 x 330 (1.97 x 2.36 – 12.99 x 12.99 )*2

BASIC INFO

SKAI 3Di-MS3 M size 3D AOI Machine

Fully compatible with both SMT and through-hole processes, the 3D-AOI meets all quality requirements for complex inspection targets, such as high-density printed circuit boards and boards housing a mix of both extremely small and tall components. The camera resolution and lighting are customizable to provide the flexibility to suit any production environment or product range.

High-Resolution

Quality high-definition images clearly depict the smallest components

Achieves total inspection – from extremely small-sized parts to the tallest components

High-definition images presenting minute parts and high-density PCBs in stunning clarity

Able to accurately inspect a range of parts with extremely clear imagery, the 3D-AOI inspects 0402mm and 0201mm components, as well as detailing narrow pitch IC and narrow pad parts.

Achieving the impossible – high-resolution imagery with an expanded height measurement range

The 3D-AOI maintains high resolution while expanding the height measurement range, achieving comprehensive inspection of both extremely small-sized and tall components. The height measurement range is up to 25mm with the resolution 8µm / 15µm camera alone, and can be expanded to 40mm when combined with the Z-axis option.

Fastest in the Industry

Performs inspections at the quickest speed possible

Stress-free, high-speed image data processing

Unparalleled AOI cycle times with both 8µm and 15µm resolution cameras

Enjoy speeds of 4,500mm²/sec with the 8µm camera and 7,000mm²/sec with the 15µm camera.
With the ability to handle components as small as 0402mm, the 15µm camera is ideal for high-volume products and those where speed is essential.

High-speed image data processing

Imaging, image data processing, and inspection are all performed in parallel – resulting in near-zero wait times.
Hardware operation and image processing are fully optimized thanks to the in-house development of customized software.

Scalability

Multiple options available, including: dome lighting, side camera, Z-axis

Conformal Coating Inspection (CCI) possible with UV lighting option

Camera resolution can be switched on-site

Upgradeable options enable a variety of board inspections with a single inspection machine

Upgrades enable continuous up-to-date performance and a wider range of inspection use from a sole unit.

Conformal Coating Inspection (CCI) possible with UV lighting*

CCI detects coverage / non-coverage areas on the entire PCB.
Extra Component Detection (ECD) is also possible.
*Optical unit for UV lighting optional.

On-site switching of camera resolution

Both resolution and speed can be switched according to the inspection target and production requirements.
Changeover can be completed in less than 90 minutes – including on-site calibration.

Optimal Functions for Each Process SMT

M2M Co-Operation with Pick-and-Place Machine

Saki AOI machines are developed for M2M communication with all major surface mount machine manufacturers.
The AOI provides feedback to the surface mount machine regarding the mounting position, greatly strengthening quality assurance.

Saki’s Total Lineup Solution

Saki’s 3D-AOI uses a common platform with 3D-SPI and 3D-CT-AXI.
The process is consistent throughout – from post-printing solder inspection using SPI, through to the inspection of mounted components.

Optimal Functions for Each Process Backend

Insertion Inspection Solution

Saki provides a wide range of inspection solutions suitable for tall inserted components, such as character and polarity inspection of tall parts, and simultaneous measurement of the solder on the board and the height of tall parts. (With Z-axis option)

Back-Side Solder Inspection Solution

The 3D-AOI automates solder inspection, supporting flow, dip, and selective soldering.
Automation guarantees a more consistent quality than visual inspection, improving the solder inspection process and saving on labor.

THT solder inspection algorithm

Using 3D information, one algorithm covers all the necessary inspection items such as pin height, solder fillet height, and bridge inspection.

Extra Component Detection (ECD) doesn’t miss any fallen objects or surplus parts

By generating statistical sample data from approximately ten defect-free images, defects such as unexpected surplus parts, solder balls, and dust in the board can be automatically detected. Even without prepared samples, defects such as solder balls can be detected using design data and threshold information.

Specifications

Dimensions	M	L	XL
Model	3Di-MS3	3Di-LS3	3Di-ZS3
Size[Main body]	850×1430×1500	1040×1440×1500	1340×1440×1500
(W) x (D) x (H) mm (in.)	(33.46 x 56.30 x 59.06)	(40.94 x 56.69 x 59.06)	(52.75 x 56.69 x 59.06)
Resolution	8μm、15μm
PCB Clearance	Top: 40 (1.57)
mm (in.)	Bottom: 60 (2.36) *1
Electric Power Requirement	Single-phase ~ 200-240V+/-10%, 50/60Hz
PCB Size	50 x 60 – 330 x 330	50 x 60 – 500 x 510	50 x 60 – 686 x 870
（W）×（L）mm (in.)	(1.97 x 2.36 – 12.99 x 12.99 )*2	(1.97 x 2.36 – 19.68 x 20.07)*3	(1.97 x 2.36 – 27.00 x 34.25)

*1 For dual mode, the PCB Clearance Bottom is 50mm (1.96 in.),
*2 For dual mode, the PCB Size is 50×60〜320×330 (1.97 x 2.36 – 12.60 x 12.99)
*3 For dual mode, the PCB Size is 50×60〜320×510 (1.97 x 2.36 – 12.60 x 20.07)