Nordson SQ3000™+ Multi-Function for 3D AOI SPI & CMM Machine

Inspection Speed:16 cm²/sec (2D+3D)
PCB Size:50 x 50 mm (2 x 2 in.);
Minimum Component Size:0201 mm (008004 in.)
Min./ Max. Feature Height::Min. 10 µm

BASIC INFO

Nordson SQ3000™+ Multi-Function for 3D AOI SPI & CMM Machine

SQ3000+ Multi-Function System with Multi-Reflection Suppression® (MRS®) sensor technology provides the ultimate combination of high resolution, high accuracy and high speed for inspection and metrology. It remains the only system on the market capable of performing AOI, SPI and CMM in-line.

Overview

Ultra-High Resolution, 5 Micron - Multi-Reflection Suppression (MRS) Technology

The SQ3000+ is powered by CyberOptics’ proprietary 3D sensing technology with sophisticated fusing algorithms that enables metrology grade accuracy at production speed. The result is ultra-high quality 3D images, high-speed inspection and metrology, and improved yields and processes.
SQ3000+ offers unmatched accuracy with the advanced MRS sensor technology by meticulously identifying and rejecting reflection-based distortions caused by shiny components and surfaces. Effective suppression of multiple reflections is critical for accurate measurements. The new, ultra-high resolution 5 micron MRS sensor incorporated into the SQ3000+ is specifically designed for advanced applications with the most demanding requirements.

Inspection and Metrology Solution for Assembly and Process Improvement for Advanced Applications
The SQ3000+ with MRS technology is ideal for high-end applications including advanced packaging, mini/micro LED, advanced SMT applications for automotive, medical, military, aerospace and advanced electronics, 008004/0201 solder paste inspection (SPI), socket metrology and other high-end coordinate measurement (CMM) applications where quality and reliability are critical.

Intuitive, Easy-to-Use Software - Enable Smarter, Faster Inspection
The multi-award winning SQ3000 AOI software is a more powerful yet extremely simple software suite designed with an intuitive interface and multi-touch control with 3D image visualization tools. Ultra-fast programming capabilities bring the ease-of-use to a completely new level and significantly speeds setup, simplifies the process, reduces training efforts and minimizes operator interaction – all saving time and cost.
Speed programming and tuning with new capabilities including AutoTeach, AutoTune and AutoDefine for faster set-up and a simplified process. AI² (Autonomous Image Interpretation) technology is all about keeping it simple - no parameters to adjust or algorithms to tune. And, you don’t need to anticipate defects or pre-define variance either. AI² does it all for you, powered by a data-rich, pre-loaded library and automated scripts that collect and update models all on their own. With AI², you have the power to inspect the most comprehensive list of features and identify the widest variety of defects. AI² offers precise discrimination with just one panel inspection making it a perfect solution for high-mix and high-volume applications.

Faster, Highly Accurate Coordinate Measurement (CMM) Suite
CyberCMM™, a comprehensive software suite of coordinate measurement tools, provides highly accurate, 100% metrology-grade measurement on all critical points much faster than a traditional CMM, including coplanarity, distance, height and datum X, Y to name a few. A fast and easy set-up can be performed with the world’s first in-line CMM system for programming complex applications as compared to slow, engineering resource-intensive set-up that typically requires multiple adjustments with traditional coordinate measurement machines (CMMs).

Specifications at a glance
Inspection Speed	16 cm²/sec (2D+3D)
PCB Size	Minimum: 50 x 50 mm (2 x 2 in.);
PCB Size	Maximum: 420 x 320 mm (16.5 x 12.5 in.)
Resolution XY / Z	5 µm / 0.1 µm
Maximum Weight (PCB or Sample)	10 kg
Component Types Inspected	Standard SMT (chips, J-lead, gull-wing, BGA, etc.), through-hole, odd-form, clips, connectors, header
Component Types Inspected	pins, and more
Solder Joint and Other Defects	Gold finger contamination, excess solder, insufficient solder, bridging, through-hole pins
Minimum Component Size	0201 mm (008004 in.)
Component Height Clearance	Top: 20 mm ; Bottom: 50 mm
Field of View (FOV)	25 x 25 mm
Min./ Max. Feature Height:	Min. 10 µm ; Max. 400 µm at spec, 2.4 mm capability
Component Defects	Missing, polarity, tombstone, billboard, flipped, wrong part, gross body and lead damage, and more
Coordinate Measurement	Line / Distance / X,Y / Mid Line, Inter Point / Regression Shifted, Datum X,Y / LSF X,Y Offset,
Capability	X,Y Offset / Value / Location / List of X,Y Values, Height / Local Height / Regression / Radius, Coplanarity/ Distance to plane / 2nd Order fitting, Difference / Absolute / 2sqrt / VC, Max / Min / Ave / Sigma / Plus / Minus / Multiple