MYCRONIC MYPro I50X 3D AOI Machine

PCB Size: 51 x 51 mm to 533 x 609 mm
Field of View: 60.5 x 60.5 mm
PCB Thickness: 0.5 to 4 mm
Resolution: 3.45 µm

BASIC INFO

MYCRONIC MYPro I50X 3D AOI Machine

AIAI-powered interface for fast and reliable programming

AccurateHigh accuracy and production stability

All-in-oneAll-in-one inspection capabilities

High-performance 3D AOI for high-mix production

The MYPro I50X brings high-performance 3D AOI within the reach of high-mix electronics producers, thanks to the extreme versatility of its inspection capabilities together with MYWizard, our next-level AI-based programming interface that reduces programming time by up to 30%.

MYPro I50X’s comprehensive test coverage enables 3D inspection of all SMT, THT and press-fit components, both at the pre-reflow and post-reflow stages.

MYWizard, a game changer in 3D AOI programming

To guide operators through programming, the new MYWizard user interface integrates two artificial intelligence systems – Auto-Matchmaker, an advanced component recognition technology, and new machine learning algorithms that inspect fiducials and component’s polarity. It results in up to 30% reduction in programming time compared with previous generations, with reduced programmer experience and training.

Escape Tracker for automated performance optimization

Next-generation self-checking system for inspection performances

With Escape Tracker, the operator is immediately informed of any errors or programming weaknesses that could potentially generate false calls or escapes during production. Fine-tuning is made much simpler, faster and more efficient regardless of production conditions or programmer skill levels.

Iris™ 3D vision technology

Faster. Sharper. Smarter.

High-performance inspection. Accelerated.

The next generation of automotive and industrial electronics demand next-generation inspection technologies. The Iris 3D vision technology pushes the limits of high-performance AOI to offer the industry’s most precise metrology and complete test coverage even at the most demanding takt times.

Sharper 3D imaging

Industry-leading performance and production stability

The MYPro I series offers best-in-class accuracy and repeatability in X, Y, Z and Theta for efficient process control. The unique combination of sub-pixel geometric pattern matching technology, proprietary 3D algorithms and unique warpage and distortion compensation leads to superior critical measurement capabilities.

Vectoral imaging pattern matching.

+/- 5 mm warpage compensation with full Z accuracy.

3.5 μm X,Y resolution with sub-pixel technology

Constant 1 µm Z resolution, from -5 up to 20 mm in altitude

All-in-one inspection capabilities

With full test coverage, the MYPro I series measures the component body, leads, and solder joints with the utmost accuracy to catch any type of defects.

Its comprehensive toolbox of ready-to-use 2D and 3D inspection tests allows the MYPro I series to inspect not only all SMT components, but also through-hole components, press-fit components, connectors of all types and shapes, and any new packages.

The board geometry and relative positions of components, pins, or connectors can also be inspected with metrological precision to further expand your test coverage and production quality.

Fully integrated process control

MYPro Link

MYPro Link, Mycronic’s award-winning web-based process control software suite, puts the benefits of inspection data correlation into real-time production. All so you can monitor your line performance over time or at a glance and get to the root cause of every defect in just a few clicks.

MYPro Analyze

Monitor your process in real time with MYPro Analyze: accurate production data help you optimize your performance and give you meaningful information to further improve and maximize first-pass yield.