MAKER-RAY AIS63X series SPI Machine

speed：0.33sec/FOV
Resolution：15um
FOV：36X30mm
weight：765KG

BASIC INFO

MAKER-RAY AIS63X series SPI Machine

Save manpower and replace the visual inspection station before final inspection;
improve quality and reduce the flow of solder joint defects in the printing process into the next process;
data traceability, large amounts of data statistics and analysis, to achieve product quality control and improvement

Product Description

Online PCBA solder paste optical inspection equipment

Detect printing defects such as insufficient tin, excessive tin, thickness, etc.

Core Advantages

-Three-point matching

Cooperate with printing machine to realize closed loop function

Bad board flight identification function and & SMT machine BadMark point sharing function

·Extremely simple programming, one-button operation, and multi-machine interconnection

Support whole board graphics storage

Support web version SPC, which can realize real-time SPC monitoring and analysis

Saves manpower and can replace the visual inspection station before final inspection;

Improve quality and reduce the flow of solder joint defects in the printing process into the next process;

Data traceability, large amounts of data statistics and analysis to achieve controllable and improved product quality

Online PCBA solder paste optical inspection equipment

Detect printing defects such as insufficient tin, excessive tin, thickness, etc.

category	project	AIS630P	AIS630P-D
PCBA Specifications	size	5050mm~510460mm	Single track operation: 5050mm~510610mm
			Double track operation: 5050mm~510330mm (the minimum distance between the two tracks is 55mm)
	thickness	0.5mm-6mm
	Component height	Top: 25mm Bottom: 50mm	Top: 25mm Bottom: 30mm
	Craft edge	3mm
Optical specifications	camera	5MP color area scan high speed industrial camera
	light source	RGBW four-color integral light source + 2-directional structured light projection unit
	FOV	36X30mm
	Resolution	15um
Detection related	Solder paste inspection	Tin height, excess tin, insufficient tin, offset, pull tip, tin connection, tin type, coplanarity, etc.
	Other Features	1D/2D code recognition, etc.
	Mixed board test	Mixed board production, support for automatic program calling
	algorithm	Deep neural network algorithms, image comparison, color comparison, contour recognition, etc.
	speed	0.33sec/FOV
Software System	operating system	Ubuntu 18.04 LTS 64bit
	Function	Remote control, remote assistance, gerber file import, custom model training
	Communication	Standard SMEMA interface
	Data Output	Automatically generate statistical analysis SPC
	Features	Automatic pad search and one-button programming
Hardware specifications	Industrial control host	CPU: Intel i7 Graphics: Gigabyte RTX1660 6G video memory
		Storage: 32G DDR, 240G SSD+2T mechanical hard disk Network: 1000M wired network card
	monitor	23.8-inch FHD display
	Sports Organization	High precision screw + servo motor
	Track width adjustment	Manual/Automatic
Appearance/Electrical	Chassis size and weight	(LHW) 111415951280mm	(LHW) 111016151600mm
		Net weight: 765KG	Net weight: 1080Kg
	Power supply and power	AC 220V, rated power 570W	AC 220V, rated power 650W
	Gas source	0.4-0.7Mpa
	Work Environment	Temperature: 10~45℃, humidity: 30~85%RH