GKG C100 Solder paste printer

Product characteristics
The pursuit of innovation, therefore excellence
Climber·C100 is a high-precision application equipment of GKG Cohesive core technology;
2. One general purpose to meet a variety of semiconductor packaging process printing;
3. Real-time pressure closed-loop system, real-time pressure correction accuracy ±0.2Kg;
4. Intelligent testing system to ensure the stability of the production process;
5.GKG integrated central control center + "Customized" Industry 4.0+ intelligent options to achieve industrial intelligence and production process information.

Maximum substrate size：510*510mm

Minimum substrate size：50*50mm

Substrate thickness dimensions：0.2~6mm

Steel mesh frame dimensions：470*370mm~737*737mm