SUNEAST SEMI-08N/SEMI-10N/SEMI-13N Reflow Soldering Machine
1. The solder paste which is printed on the convex metal surface will be refluxed into a ball to complete the combination welding of the tin ball and the substrate.
2. After the chip is placed to the PCB, the chip and the circuit board are connected together to realize the chip packaging and integrated circuit manufacturing.
Product Details
Features:
1. Hot air system with patent, efficient heat compensation ability, accurate temperature control accuracy.
2. With nitrogen protection in the whole process, independent nitrogen control in each temperature zone, to prevent components oxidation during the welding process.
3. Low oxygen content control in the furnace which will be within 50-200PPM during the whole process, to ensure good welding quality.
4. Modular design, efficient cooling system, cooling slope can reach 0.5-6℃/S, to meet the requirements of each process cooling slope.
5. Fine mesh belt for smooth conveying, also for tiny components transmission, prevent falling, to ensure stable product quality.
6. Efficient and clean treatment, to meet the requirements of dust-free workshop for semiconductor.