TRI TR7007D/DI Plus SPI Machine

Imaging Resolution:5.5 μm, 6 μm, 10 μm , 15 µm (factory setting)
Imaging Speed:4 MP Camera Link: Up to 3 FOV/sec
Max PCB Size:@5.5 μm, 6 μm - 400 x 330 mm, @10 & 15 μm - 510 x 460 mm
Max PCB Weight:3kg. Optional: 5kg

BASIC INFO

TRI TR7007D/DI Plus SPI Machine

The TR7007D/DI Plus 3D SPI platform is equipped with an improved motion controller (EtherCAT) and an enhanced 2D lighting module. The TR7007D/DI Plus can accurately inspect low solder bridges and compensate board warpage for eliminating local PCB deformation. The TR7007D/DI Plus is equipped with two projectors to ensure seamless shadow-free inspection. The SPI solution eases data exchange between the production line and the MES of your choice to enable data traceability for the connected factory.

Features

• Enhanced 2D Lighting, for higher uniformity inspection.
• New motion controller, EtherCAT, for real-time measurements.
• Smart Factory solution with Real-time SPC Trends.
• Closed Loop Ready: Feedback and Feedforward Capabilities.

Specification

Imaging Method	Stop-and-Go Imaging
Camera	4 Mpix or 12 Mpix (factory setting)
Imaging Resolution	5.5 μm, 6 μm, 10 μm , 15 µm (factory setting)
Lighting	Enhanced 2D Lights (RGB+W)
3D Technology	2-way Digital Fringe Pattern
Field of View	4 MP Camera Link-
	@ 10 μm: 20.3x20.3 mm
	@ 15 μm: 30.5x30.5 mm

	12 MP Camera Link-
	@ 5.5 μm: 22.5x16.5 mm
	@ 10 μm: 40.6x30.7 mm
	@ 15 μm: 61x46 mm

	12 MP CoaXPress-
	@ 6 μm: 24.3x18.4 mm
	@ 10 μm: 40.6x30.7 mm
	@ 15 μm: 61x46 mm
Inspection Performance
Imaging Speed	4 MP Camera Link: Up to 3 FOV/sec
	12 MP Camera Link: Up to 1.8 FOV/sec
	12 MP CoaXPress: Up to 2.6 FOV/sec
Height Resolution	@10 μm/15 μm: 0.45 μm
Height Resolution	@5.5 μm/6 μm: 0.22 μm
Max. Solder Height	@10 μm/15 μm: 420 μm/750 μm
	@5.5 μm/6 μm: 210 μm/310 μm

	* on Calibration Target
Motion Table & Control
X-Axis Control	Ballscrew + EtherCAT motion controller
Y-Axis Control	Ballscrew + EtherCAT motion controller
Z-Axis Control	Ballscrew + EtherCAT motion controller
X-Y Axis Resolution	0.5 μm
Z-Axis Resolution	1 µm
Board Handling
Max PCB Size	TR7007D/DI Plus:@5.5 μm, 6 μm - 400 x 330 mm, @10 & 15 μm - 510 x 460 mm
	TR7007D/DI Plus DL:@10 μm, 15 μm - 510x310 mm x 2 Lanes, 510x590 mm x 1 Lane
	TR7007LD Plus:@6 μm, 10 μm, 15 μm - 765 x 610 mm
PCB Thickness	0.6 - 5mm
Max PCB Weight	3kg. Optional: 5kg
Top Clearance	@5.5 μm, 6 μm: 25 mm; @10 μm, 15 μm: 50 mm
Bottom Clearance	40 mm
Edge Clearance	3 mm
Conveyor Height	880 – 920 mm

	* SMEMA Compatible
Inspection Functions
Defects	Insufficient Paste
	Excessive Paste
	Shape Deformity
	Missing Paste & Bridging
Measurement	Height
	Area
	Volume
	Offset
Dimensions
WxDxH	TR7007D Plus: 1000 x 1400 x 1650 mm
	TR7007D Plus DL: 1000 x 1500 x 1650 mm
	TR7007LD Plus: 1365 x 1720 x 1710 mm

	TR7007DI Plus: 1000 x 1360 x 1600 mm
	TR7007DI Plus DL: 1000 x 1717 x 1600 mm

	Note: not including signal tower, signal tower height 515 mm
Weight	TR7007D Plus: 775 kg
	TR7007D Plus DL: 825 kg
	TR7007LD Plus: 982 kg

	TR7007DI Plus: 775 kg
	TR7007DI Plus DL: 825 kg