OMRON VT-S1080 3D AOI Machine

FOV ：50.0 x 37.5mm
Max PCB: 510(W) x 680(D)mm
Weight Approx：1250 kg
Dimensions：1180(W) x 1450(D) x 1500(H)mm

BASIC INFO

OMRON VT-S1080 3D AOI Machine

The VT-S1080 is the world’s most advanced 3D AOI system, designed for the high-quality manufacturing market. New technologies to overcome the shortfall in production yields traditionally caused by shadow, reflection and cycle-time to realize unmanned inspection process in combination with labor-saving maintenance, using predictive maintenance.

Fastest cycle-times with high performance 25Mpix Camera.

Oblique angle inspection with 4-Direction Cameras for those hidden solder joints.

Industry-first MDMC Illumination: 3D imaging from all angles enables accurate inspection of complicated

solder shapes.

Elimination of Shadow and Secondary Reflection with 4-Direction MPS Projectors

First Pass Yield efficiency up to 99%.

Complete Offline Program Generation without Interrupting Production.

Unique AI for Skill-less labor-saving Program Optimization.

Unique Global Library to maintain same quality standard across all Production Lines.

Unique Connection to: Omron Qup Navi: Combine Omron SPI, AOI and AXI Result Data Together for True Root-Cause Analysis.

Unique Connection to: Omron Qup Opti: Skill-less SPI Setting and Optimisation calculated from AOI Solder Values.

Unique Connection to: Omron Qup Auto-I: Production Quality Analysis across your Entire Production Line.

Unique Connection to Omon Qup Auto-C: maintains high quality and high productivity autonomously in your production line.

Features

AI-assisted qualitative inspection conforming to international standards

Since values conforming to the standards are directly applied as inspection criteria, there is no dependency on the skill and expertise of the programmer.

AI technology to minimize programming and visual inspection efforts

1. AI self-optimization

2. Automatically acquire defect images for analysis and visualization of result data separation for AI-assisted defect determination

3. Visualization of the AI-determined settings

High-precision solder shape reconstruction

Equipped with our unique MDMC (Multi Direction/Multi Color) illumination and new patented MPS (Micro Phase Shift) Moiré Technique. This enables higher robust and reliable inspection performance.

M2M*1 system focusing on quality

1. Preventing defects by:

monitoring and reporting fluctuations in the measured values during production

visualizing defect trends associated with chip mounter hardware such as heads and nozzles

2. Visualizing the quality by:

process comparison

displaying production status

linking SPI/AOI/AXI systems

3. Improving the first pass yield rate of the line by automatically calculating post-print/post-placement inspection criteria based on the inspection results after the solder reflow process