Kulicke & Soffa Hybrid 3 Pick and place machine

A single machine solution for WLP manufacturing. Flip Chips, Bare dies or SMD’s can be mounted on wafers up to 300 mm or panels up to 800 mm length.

- Accuracy up to 7 µm CpK > 1.0

- Ultra-low placement defect levels; below 1 dpm

- Output up to 165 K

- 0201M/008004 capability

- Placing thin components without cracking

- Full control of your process

- Full traceability

Options

CPR2: 15 micron Compact Placement Robot

Designed for speed, high accuracy and lowest cost of ownership
 Main benefits:
- 15 micron placement accuracy at full speed (no output penalty)
- No need to include an expensive Flip Chip bonder in the assembly line
- Maintenance free air bearing technology
- Field upgradable
- Lowest cost of ownership
CPR2 Compact Placement Robot is compatible with iX 502, iX 302 and Hybrid Wafer Feeder

Slim Fit Tape Feeder

The next generation Feeding Platform from K&S
Designed for robustness, low cost of ownership and better pick performance

Main benefits:
- Lowest cost of ownership
- Ease of use
- High performance
- Industry 4.0 ready
- Flexibility
- Improved OEE
Available feeder types:
SF Feeder 4 mm, SF Feeder 8 mm, SF Feeder 12 mm, SF Feeder 16 mm, SF Feeder 24 mm
SF Feeder 32 mm, SF Feeder 44 mm, SF Feeder 56 mm, SF Feeder 72 mm, 
SF Feeder 88 mm
SF Feeder platform compatible with AX-501, AX-301, iX502, iX-302 and iFlex

 

SF Feeder Trolley

Feeder trolleys for fast changeover and setups.
Feeder trolleys come standard with the iFlex . An additional set of trolleys can be obtained for offline setup preparation. Changeovers can be then executed in just minutes.

- Trolley exchange time: Less than 1 minute

- Offline trolley preparation possible with offlinee setup assistant factory software

- Maximum number of feeding lanes: 68

- Tape Cutters: Optional

 

Wafer Feeder

- Die size range [mm]: 0.5 x 0.5 – 26 x 26 (smaller dies on request)

- Minimum die thickness [µm]: 50

- Pick force range [N]: 0.5 – 5

- Wafer size [mm]: ≤ 300

- Wafer frame size: 8 – 12”

- Output [UPH]: 9K (die 1 x 1 mm) 27K with 3 Wafer Feeders

- Camera Max. die size [mm]: 26 x 26

- Camera Min. bump size [µm]: 30

- Fluxer Max. die size [mm]: 26 x 26

- Coplanarity check: Yes

Dip Station

Dip fluxing station with coplanarity adjustment for various flux depths.
Flux chamber depth:
75 µm
75 / 100 µm
100 µm
(others on request)
Maximum component size:
26 x 26 mm in single chambers
12 x 12 mm with double chambers
Used for: Paste and Flux
Occupied feeder slots: 4
Flux slots adjustments: Co-planar

 

Accuracy Service

Accuracy verification service: measurement, verification and calibration. Including report.
Tools, services and reporting to guarantee placement accuracy, year after year.

- Measurement results per head in CpK

- Automatic placement offset correction

- Offset correction verification Reporting

Placement Force Service

Placement force verification service, including report. Tools, services and reporting to guarantee placement force, year after year.

- Measurements per head in Newton

- Reporting

Feeder Service Shop

Lower your feeder inventory by controlling feeder maintenance, performance verification, repair and calibration. All at hand in factory for quick return of feeders into production.

Technical specifications	Hybrid 5	Hybrid 3
Maximum output per hour	165 k	99 k
	(121k IPC 9850A)	(79k IPC 9850A)
Maximum output per hour for flip chip bonding (IPC 9850)	10.5 - 16 kwith dipping	10.5 - 16 kwith dipping
	13.5 - 27 kwithout dipping	13.5 - 27 kwithout dipping
Placement quality	< 1 dpm	< 1 dpm
Placement accuracy @ CpK1	25 μm for passives	25 μm for passives  CPR/SPR
	18 μm for QFP/BGA/FC	18 μm for QFP/BGA/FC  SPR/TPR
	7 μm for flip chips1	7 μm for flip chips1   TPR
Minimum component size (LxW):	0.25 x 0.125 mm (0201m)	0.25 x 0.125 mm (0201m)
Maximum component size (LxW):	45 x 45 mm (1.77 x 1.77”)	45 x 45 mm (1.77 x 1.77”)
Maximum component height:	10.5 mm (0.41”)	10.5 mm (0.41”)
- Optional	12 mm (0.47”)	12 mm (0.47”)
Placement force range	0.5 to 8 N	0.5 to 8 N
Maximum board size (LxW):
- Standard	515 x 390 mm (20.28 x 15.35”)	475 x 390 mm (18.7 x 15.35”)
- Optional	800 x 457 mm (31.5 x 18”)	800 x 457 mm (31.5 x 18”)
Minimum board size (LxW):
- Standard	50 x 50 mm (2 x 2”)	50 x 50 mm (2 x 2”)
- Optional	50 x 25 mm (2 x 1”)	50 x 25 mm (2 x 1”)
Maximum optional board length	800 mm (31.5”)	800 mm (31.5”)
Maximum optional board width	543 mm (21.4”)	543 mm (21.4”)
Board thickness:
- Standard	0.3 to 6 mm (0.01 to 0.24”)	0.3 to 6 mm (0.01 to 0.24”)
- Optional	≥ 0.05 mm	≥ 0.05 mm
Automatic toolbit exchange	Nozzles	Nozzles
Maximum tape feeding positions (8mm):
Single lane feeders	130	76
Twin tape feeders	260	156
Feeding options	Tape, waffle pack, tray, wafer, others	Tape, waffle pack, tray, wafer, others
(special feeders on request)

SMT Pick and place machine Brand

Efficient Technology Co.,Ltd provide a full SMT assembly line solutions, including SMT Production Line, SMT Pick and place machine, SMT Stencil Printer, SMT Inspection equipment, SMT Weling equipment, SMT Intelligent Storage System, SMT Automatic Insertion Machine, SMT Peripheral Equipment, SMT Feeders, SMT Nozzles, SMT Spare Parts etc any kind SMT machines you may need, please contact us for more information:  WeChat: +8613714564591  Email: sales@efsmt.com

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