China SD-850 BGA Rework Station

Integrated design of hot air head and placement head, with automatic placement, automatic welding and automatic disassembly functions.

The hot air system is adopted in the upper part of the limelight, with fast heating, uniform temperature and fast cooling, which can better meet the technical requirements of lead-free soldering. The lower heating zone is heated by infrared + hot air mixture. The infrared rays directly act on the heating area and conduct with the hot air at the same time. This can make up for the mutual deficiency and make the PCB heat up quickly while maintaining a uniform temperature.

Independent three temperature zones (upper temperature zone, lower temperature zone, infrared preheating zone), the upper temperature zone and the lower temperature zone realize synchronous automatic movement, and can automatically reach any position in the bottom infrared preheating zone. The lower temperature zone can move up and down to support the PCB, and is automatically controlled by a motor. Realize that the PCB does not move on the fixture, and the upper and lower heating heads can move to the target chip of the PCB as a whole.

The PCB card board adopts high-precision sliders to ensure the placement accuracy of BGA and PCB boards.

The original bottom preheating platform adopts excellent heating materials imported from Germany + anti-glare constant temperature glass with a preheating area of 500*420mm.

The preheating platform, splint device and cooling system can move in the X direction as a whole. Make PCB positioning, folding and soldering safer and more convenient.

X, Y use the motor automatic control movement mode, which makes the alignment fast and convenient, and the equipment space is fully utilized. The relatively small equipment volume realizes super large-area PCB rework. The maximum splint size can reach 510*480mm, and there is no dead angle for rework. ;

Double joystick control, alignment lens and upper and lower heating platforms to ensure alignment accuracy;

Built-in vacuum pump, φ angle rotation, fine-tuning placement nozzle;

The suction nozzle automatically recognizes the suction and placement height, and the pressure can be controlled within a small range of 10 grams. It has the function of 0-pressure suction and placement, and is aimed at smaller chips;

Color optical vision system with manual X, Y direction movement, spectroscopic two-color, magnification and fine-tuning functions, including color difference resolution device, auto-focus, software operation function, and the maximum BGA size that can be repaired is 80*80 mm;

Alloy hot air nozzles of various sizes are easy to replace and can be rotated and positioned by 360°;

Equipped with 5 temperature measurement ports, with multi-point real-time temperature monitoring and analysis functions;

It has the function of solid-state operation display, which makes the temperature control more safe and reliable; it has the function of nitrogen distribution;

The machine can automatically generate SMT standard temperature disassembly curves at different ambient temperatures in different regions, without manual setting of machine curves, and can be used by operators with or without experience, realizing machine intelligence;

With a camera for observing the melting point on the side of the solder ball, it is convenient to determine the curve (this function is optional).

Specification