China SD-800 BGA Rework Station

1. The integration design of hot air head and mounting head, with automatic mounting automatic welding and automatic removal function.

 2. The upper air head adopts hot air system, heating up fast, temperature uniformity, cooling fast (can suddenly drop 50-80 degrees when cooling down), to better meet the process requirements of lead-free welding. Lower heat temperature zone are using infrared + hot air mixed heating, infrared direct action on the heating area, and hot air conduction at the same time, which can make up for the mutual shortcomings, so that the PCB heating fast (heating rate of 10 ℃ / S), while still maintaining a uniform temperature;.

 3. Independent three temperature zones (upper temperature zone, lower temperature zone, infrared preheating zone), the upper temperature zone and lower temperature zone to achieve synchronous automatic movement, can automatically reach the bottom of the infrared preheating zone in any position. The lower temperature zone can be moved up and down to support the PCB, which is automatically controlled by motor. To realize the PCB in the fixture does not move, the upper and lower heating head can move to the target chip of the PCB in one piece.

 4. PCB cardboard adopts high precision slider to ensure the accuracy of BGA and PCB board placement;

 5. The original bottom preheating platform, using Germany imported excellent heating materials (infrared gold-plated light tube) + anti-dazzle constant temperature glass (temperature resistance up to 1800 ℃) preheating area of 500 * 420mm;

 6. Preheating platform, plywood device and cooling system can be moved in X direction as a whole. PCB positioning, folding and welding safer and more convenient. 

7. X, Y using automatic motor control of movement, so that alignment is fast and convenient, equipment space is fully utilized, with a relatively small equipment volume to achieve a large area of PCB rework, the maximum clamping board size up to 510 * 480mm, no rework dead space.

 8. Double rocker control, alignment lens and upper and lower heating platform, thus ensuring alignment accuracy.

 9. Built-in vacuum pump, φ angle rotation, precision fine-tuning placement nozzle.

 10. Automatic nozzle recognition suction material and mounting height, pressure can be controlled within 10 grams tiny range, with 0 pressure suction material, mounting function, for smaller chips.

 11. Color optical vision system with manual X, Y direction movement, with dichroic, magnification and fine-tuning function, including chromatic aberration resolution device, auto-focus, software operation function, can rework maximum BGA size 80*80 mm.

 12. A variety of sizes of alloy hot air nozzle, easy to replace, can be rotated 360 ° positioning.

 13. Equipped with 5 temperature measurement ports, with multi-point real-time temperature monitoring and analysis function. 

14. With solid-state operation display function, so that the temperature control is more safe and reliable.

 15. The machine can automatically generate SMT standard temperature disassembly curve in different regions under different environmental temperatures, without manual setting of the machine curve, experienced operators can use, to achieve machine intelligence.

 16. With a camera to observe the melting point of the side of the tin ball, easy to determine the curve (this function is optional).

Specification