ASM SIPLACE CA2 Pick and place machine

Placement Speed : 76,000 CPH
Applicable PCB : 50*50 - 375*430mm
Applicable Part : 0201m - 8.2mm
Accuracy: ± 20 µm at 3 σ

BASIC INFO

ASM SIPLACE CA2 Pick and place machine

Revolutionize your manufacturing with the ASM SIPLACE CA2 Pick and place machine- our groundbreaking chip assembly and SMT placement solution. With seamless integration of bare dies and SMT placement without additional special processes, we offer you a significant competitive advantage.

High-speed chip assembly directly from wafer and SMT placement in one machine

- Smart devices, 5G communication standards, autonomous driving: Only consistent miniaturization and ever-increasing complexity in electronics make all of this possible. The key technology behind this is System in Packages (SiP): ICs and SMT components are combined into a compact, highly innovative system.

- As a hybrid combination of a SMT placement machine and a die bonder, the new SIPLACE CA2 can process both SMDs supplied from changeover tables and feeders as well as dies taken directly from the sawn wafer in a single work step. By integrating the complex die bonding process into the SMT line it eliminates the need for special machines in production. With reduced personnel deployment, high connectivity, and integrative data utilization, the SIPLACE CA2 is therefore the perfect match for the Intelligent Factory.

Placement directly from the wafer: more cost-effective and sustainable

Discover the efficiency of direct wafer placement: By eliminating the taping process, operators have fewer replenishment and splicing tasks as well as less effort for material feeding. In just one year, 800 km of tape can be saved with 24/7 SiP production.

Two worlds in one machine

- Maximum productivity

Processes SMT components and dies directly from the wafer with die-attach and flip-chip processes in the same work step.

- Cost-saving

No taping cost, no associated quality cost of the die-taping process, and no efforts for tape-waste disposal.

- Unique flexibility

Wafer system for up to 50 different wafers with a wafer swap time of less than 10 seconds (“full multi-die capability”). A wafer chuck, flux (linear) dipping unit (LDU) and 10 x 8 mm tape-and-reel feeder tracks can be used parallel to pick up from wafer.

- Full traceability

Keep track of data for each die from its source on the wafer to its placement position on the circuit board ("full single-die-level-traceability").

- Consistent sustainability

This allows you to operate sustainably and efficiently: die processing directly from the diced wafer not only saves you the entire die-taping process but also significantly reduces tape waste. Within a year, you can save 800 km of tape in 24/7-SiP production.

- Maximum performance

Thanks to die buffering and process parallelization, the SIPLACE CA2 can place up to 54,000 components per hour directly from wafer with an accuracy of up to 10 μm @ 3 σ.

- Comprehensive quality management

Multiple high-end vision systems reliably recognize even the smallest components and elements for comprehensive process control.

Two machines - one line

The combination of the SIPLACE CA2 with the SIPLACE TX micron high-speed placement machine from ASMPT is particularly interesting in SiP production: both machines can be installed in one production line and complement each other - for maximum flexibility and maximum yield.

SIPLACE CA2
Placement speed (benchmark)	SMT up to 76,000 cph
	Flip chip from wafer up to 51,000 cph
	Die attach from wafer up to 54,000 cph
Wafer swap	10 seconds
Placement accuracy (3 σ)	20 μm / 15 µm / 10 μm (can be selected on placement position and component shape level)
	20 µm @ 3 σ	15 µm & 10 µm @ 3 σ
PCB dimensions (l × w)	50 mm × 45 mm to 375 mm × 260 mm (dual-lane mode)	50 mm × 55 mm to 250 mm × 100 mm
	50 mm × 45 mm to 375 mm × 430 mm (single-lane mode)
Machine dimensions (l × w × h)	2.56 m × 2.50 m × 1.85 m
Feeder slots	up to 80 × 8-millimeter tape-and-reel feeder or up to
	2 × Multi Wafer System and 10 × 8-millimeter tape-and-reel feeder
Power consumption (average)	1.9 kW
Air consumption	120 Nl/min (2 x SIPLACE CP20)
Certifications	CE, SEMI S2/S8, Clean room class ISO 7
Data interfaces	IPC-HERMES-9852, IPC-CFX, IPC-SMEMA-9851, SECS/GEM
Placement head	SIPLACE CP20
Component range	from tape-and-reel: 0201m up to 8.2 mm × 8.2 mm
	from wafer: 0.3 mm × 0.3 mm up to 8.2 mm × 8.2 mm
Min. lead pitch	70/50* µm
Min. lead width	30/25* µm
Min. ball pitch	100/50* µm
Min. ball diameter	50/25* µm