ASM SIPLACE CA Pick and place machine

Placement Speed : 126,500 CPH
Applicable PCB : 50*50 - 685*685mm
Applicable Part : 0201m - 6mm
Accuracy: ± 15 µm at 3 σ

BASIC INFO

ASM SIPLACE CA Pick and place machine

Chip assembly and SMT placement in a single machine

Integrate high-growth technologies of the future such as flip chips and die attach into your SMT production with the ASM SIPLACE CA Pick and place machine, the world’s first platform that lets you flexibly combine the placement of bare dies directly from the wafer with classic feeder-based SMT placement.

Your competitive advantage: New, future-proof applications can be implemented on a single SMT line without any additional special processes. It is the ideal machine for “Advanced Packaging” applications. Another benefit: For all other jobs, the SIPLACE CA operates as a powerful “normal” SMT placement machine.

- The ASM SIPLACE CA has a throughput of 46000 cph (flip chip), 30000 cph (die attach), and 126500 cph (SMD).

- ASM SIPLACE CA supports die sizes of 0.5-15.0 mm (flip chip), 0.8-15.0 mm (die attach) & 0.11-15.0 mm (SMD), and a die thickness of more than 50 μm (silicon).

- ASM SIPLACE CA supports various packages like RF-MCM, FCIP, FC-MLF, FC-CSP, etc.

- The SIPLACE CA supports wafer sizes from 4 to 12 inches and has a 12/8-inch (6 and 4-inch optional) wafer stretcher to stretch wafers from 2 to 8 mm. It supports flexible dual, single-lane, wafer-lane lane & panel-lane conveyors.

- ASM SIPLACE CA supports substrates like FR4, ceramics, flex, boats, 8/12-inch wafers, etc. of sizes ranging from 50 x 50 mm to 685 x 685 mm (conveyor type dependent) and thickness from 0.3 to 4.5 mm.

- ASM SIPLACE CA can handle hoop rings and supports wafer maps.This horizontal wafer system has multi-die capability and supports automatic wafer exchange.

- The SIPLACE CA has a footprint of 3778 x 2100 x 1835 mm and requires a three-phase AC supply of 400 V.

SIPLACE CA		Panel Level Configuration		Wafer Level Configuration
Application		Flip Chip	Die Attach	Flip Chip	Die Attach	SMD
Accuracy		± 12 µm at 3 σ	± 12 µm at 3 σ	± 10 µm at 3 σ	± 10 µm at 3 σ	± 15 µm at 3 σ
Throughput	CP20M2	46	30	46	30	126
(flip chip without dipping)	CPPM	41	29	41	29	85
Die / component sizes CP20M2		0.5 – 6mm	0.8 – 6 mm	0.5 – 6mm	0.8 – 6 mm	0201m – 6mm
Die / component sizes CPPM		0.5 – 15mm	0.8 – 15mm	0.5 – 15mm	0.8 – 15mm	0402m – 15mm
Die thickness min. (Silicon)		50 µm	50 µm	50 µm	50 µm	n / a
Bump size min. 3)		25 µm	n / a	25 µm	n / a	n / a
Bump pitch min. 3)		50 µm	n / a	50 µm	n / a	n / a
SIPLACE Wafer System SWS		Horizontal system, automatic wafer exchange, MCM
SWS wafer size		4″ – 12″				n / a
Wafer stretcher		12″ / 8″				n / a
Wafer stretch range		2mm – 8 mm				n / a
Die eject system		Programmable eject speed
Linear Dipping Unit LDU		Free programmable flux application speed